MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
______________________________________________________________________________________ 13
Figure 4. Main PWM Comparator Block Diagram
FB_
REF
CSH_
CSL_
SLOPE COMPENSATION
VL
I1
R1 R2
TO PWM
LOGIC
OUTPUT DRIVER
UNCOMPENSATED
HIGH-SPEED
LEVEL TRANSLATOR
AND BUFFER
I2 I3 V
BIAS
In PWM mode, the controller operates as a fixed-
frequency current-mode controller where the duty ratio
is set by the input/output voltage ratio. The current-
mode feedback system regulates the peak inductor
current value as a function of the output-voltage error
signal. In continuous-conduction mode, the average
inductor current is nearly the same as the peak current,
so the circuit acts as a switch-mode transconductance
amplifier. This pushes the second output LC filter pole,
normally found in a duty-factor-controlled (voltage-
mode) PWM, to a higher frequency. To preserve inner-
loop stability and eliminate regenerative inductor
current “staircasing,” a slope compensation ramp is
summed into the main PWM comparator to make the
apparent duty factor less than 50%.
The MAX1630 family uses a relatively low loop gain,
allowing the use of lower-cost output capacitors. The
relative gains of the voltage-sense and current-sense
inputs are weighted by the values of current sources
that bias three differential input stages in the main PWM
comparator (Figure 4). The relative gain of the voltage
comparator to the current comparator is internally fixed
at K = 2:1. The low loop gain results in the 2% typical
load-regulation error. The low value of loop gain helps
reduce output filter capacitor size and cost by shifting
the unity-gain crossover frequency to a lower level.
The output filter capacitors (Figure 1, C1 and C2) set a
dominant pole in the feedback loop that must roll off the
loop gain to unity before encountering the zero intro-
duced by the output capacitor’s parasitic resistance
(ESR) (see Design Procedure section). A 60kHz pole-
zero cancellation filter provides additional rolloff above
the unity-gain crossover. This internal 60kHz lowpass
compensation filter cancels the zero due to filter capaci-
tor ESR. The 60kHz filter is included in the loop in both
fixed-output and adjustable-output modes.
Synchronous Rectifier Driver (DL)
Synchronous rectification reduces conduction losses in
the rectifier by shunting the normal Schottky catch diode
with a low-resistance MOSFET switch. Also, the synchro-
nous rectifier ensures proper start-up of the boost gate-
driver circuit. If the synchronous power MOSFETs are
omitted for cost or other reasons, replace them with a
small-signal MOSFET, such as a 2N7002.
If the circuit is operating in continuous-conduction
mode, the DL drive waveform is simply the complement
of the DH high-side drive waveform (with controlled
dead time to prevent cross-conduction or “shoot-
through”). In discontinuous (light-load) mode, the syn-
chronous switch is turned off as the inductor current
falls through zero. The synchronous rectifier works
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
14 ______________________________________________________________________________________
under all operating conditions, including Idle Mode.
The SECFB signal further controls the synchronous
switch timing in order to improve multiple-output cross-
regulation (see Secondary Feedback Regulation Loop
section).
Internal VL and REF Supplies
An internal regulator produces the +5V supply (VL) that
powers the PWM controller, logic, reference, and other
blocks within the IC. This 5V low-dropout linear regula-
tor supplies up to 25mA for external loads, with a
reserve of 25mA for supplying gate-drive power.
Bypass VL to GND with 4.7µF.
Important: Ensure that VL does not exceed 6V.
Measure VL with the main output fully loaded. If it is
pumped above 5.5V, either excessive boost diode
capacitance or excessive ripple at V+ is the probable
cause. Use only small-signal diodes for the boost cir-
cuit (10mA to 100mA Schottky or 1N4148 are pre-
ferred), and bypass V+ to PGND with 4.7µF directly at
the package pins.
The 2.5V reference (REF) is accurate to ±2% over tem-
perature, making REF useful as a precision system ref-
erence. Bypass REF to GND with 1µF minimum. REF
can supply up to 5mA for external loads. (Bypass REF
with a minimum 1µF/mA reference load current.)
However, if extremely accurate specifications for both
the main output voltages and REF are essential, avoid
loading REF more than 100µA. Loading REF reduces
the main output voltage slightly, because of the refer-
ence load-regulation error.
When the 5V main output voltage is above 4.5V, an
internal P-channel MOSFET switch connects CSL5 to
VL, while simultaneously shutting down the VL linear
regulator. This action bootstraps the IC, powering the
internal circuitry from the output voltage, rather than
through a linear regulator from the battery.
Bootstrapping reduces power dissipation due to gate
charge and quiescent losses by providing that power
from a 90%-efficient switch-mode source, rather than
from a much less efficient linear regulator.
Boost High-Side Gate-Drive Supply
(BST3 and BST5)
Gate-drive voltage for the high-side N-channel switches
is generated by a flying-capacitor boost circuit
(Figure 2). The capacitor between BST_ and LX_ is
alternately charged from the VL supply and placed par-
allel to the high-side MOSFET’s gate-source terminals.
On start-up, the synchronous rectifier (low-side
MOSFET) forces LX_ to 0V and charges the boost
capacitors to 5V. On the second half-cycle, the SMPS
turns on the high-side MOSFET by closing an internal
switch between BST_ and DH_. This provides the nec-
essary enhancement voltage to turn on the high-side
switch, an action that “boosts” the 5V gate-drive signal
above the battery voltage.
Ringing at the high-side MOSFET gate (DH3 and DH5)
in discontinuous-conduction mode (light loads) is a nat-
ural operating condition. It is caused by residual ener-
gy in the tank circuit, formed by the inductor and stray
capacitance at the switching node, LX. The gate-drive
negative rail is referred to LX, so any ringing there is
directly coupled to the gate-drive output.
Current-Limiting and Current-Sense
Inputs (CSH and CSL)
The current-limit circuit resets the main PWM latch and
turns off the high-side MOSFET switch whenever the
voltage difference between CSH and CSL exceeds
100mV. This limiting is effective for both current flow
directions, putting the threshold limit at ±100mV. The
tolerance on the positive current limit is ±20%, so the
external low-value sense resistor (R1) must be sized for
80mV/I
PEAK
, where I
PEAK
is the required peak inductor
current to support the full load current, while compo-
nents must be designed to withstand continuous cur-
rent stresses of 120mV/R1.
For breadboarding or for very-high-current applications,
it may be useful to wire the current-sense inputs with a
twisted pair, rather than PC traces. (This twisted pair
needn’t be anything special; two pieces of wire-wrap
wire twisted together are sufficient.) This reduces the
possible noise picked up at CSH_ and CSL_, which can
cause unstable switching and reduced output current.
The CSL5 input also serves as the IC’s bootstrap sup-
ply input. Whenever V
CSL5
> 4.5V, an internal switch
connects CSL5 to VL.
Oscillator Frequency and
Synchronization (SYNC)
The SYNC input controls the oscillator frequency. Low
selects 200kHz; high selects 300kHz. SYNC can also
be used to synchronize with an external 5V CMOS or
TTL clock generator. SYNC has a guaranteed 240kHz
to 350kHz capture range. A high-to-low transition on
SYNC initiates a new cycle.
300kHz operation optimizes the application circuit for
component size and cost. 200kHz operation provides
increased efficiency, lower dropout, and improved
load-transient response at low input-output voltage dif-
ferences (see Low-Voltage Operation section).
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
______________________________________________________________________________________ 15
Table 4. Operating Modes
SEQ RUN/ON3 DESCRIPTION
XLow X All circuit blocks turned off. Supply current = 4µA.
SHDN
TIME/ON5
X
MODE
Shutdown
Low StandbyLowHigh Ref Both SMPSs off. Supply current = 30µA.
Low RunHigh
High RunLowHigh Ref 5V SMPS enabled/3.3V off
High Ref 3.3V SMPS enabled/5V off
High RunHigh
Timing capacitor StandbyLowHigh GND Both SMPSs off. Supply current = 30µA.
Timing capacitor RunHigh
Timing capacitor StandbyLowHigh VL Both SMPSs off. Supply current = 30µA.
High
High Ref Both SMPSs enabled
GND Both SMPSs enabled. 5V enabled before 3.3V.
Timing capacitor RunHighHigh VL Both SMPSs enabled. 3.3V enabled before 5V.
X = Don’t Care
Shutdown Mode
Holding SHDN low puts the IC into its 4µA shutdown
mode. SHDN is logic input with a threshold of about 1V
(the V
TH
of an internal N-channel MOSFET). For auto-
matic start-up, bypass SHDN to GND with a 0.01µF
capacitor and connect it to V+ through a 220kΩ resistor.
Power-Up Sequencing
and ON/
OFF
Controls
Start-up is controlled by RUN/ON3 and TIME/ON5 in
conjunction with SEQ. With SEQ tied to REF, the two
control inputs act as separate ON/OFF controls for
each supply. With SEQ tied to VL or GND, RUN/ON3
becomes the master ON/OFF control input and
TIME/ON5 becomes a timing pin, with the delay
between the two supplies determined by an external
capacitor. The delay is approximately 800µs/nF. The
+3.3V supply powers-up first if SEQ is tied to VL, and
the +5V supply is first if SEQ is tied to GND. When driv-
ing TIME/ON5 as a control input with external logic,
always place a resistor (>1kΩ) in series with the input.
This prevents possible crowbar current due to the inter-
nal discharge pull-down transistor, which turns on in
standby mode and momentarily at the first power-up or
in shutdown mode.
RESET
Power-Good Voltage Monitor
The power-good monitor generates a system RESET sig-
nal. At first power-up, RESET is held low until both the
3.3V and 5V SMPS outputs are in regulation. At this point,
an internal timer begins counting oscillator pulses, and
RESET continues to be held low until 32,000 cycles have
elapsed. After this timeout period (107ms at 300kHz or
160ms at 200kHz), RESET is actively pulled up to VL. If
SEQ is tied to REF (for separate ON3/ON5 controls), only
the 3.3V SMPS is monitored—the 5V SMPS is ignored.
Output Undervoltage Shutdown Protection
(MAX1630/MAX1631/MAX1632)
The output undervoltage lockout circuit is similar to
foldback current limiting, but employs a timer rather
than a variable current limit. Each SMPS has an under-
voltage protection circuit that is activated 6144 clock
cycles after the SMPS is enabled. If either SMPS output
is under 70% of the nominal value, both SMPSs are
latched off and their outputs are clamped to ground by
the synchronous rectifier MOSFETs (see Output
Overvoltage Protection section). They won’t restart until
SHDN or RUN/ON3 is toggled, or until V+ power is
cycled below 1V. Note that undervoltage protection can
make prototype troubleshooting difficult, since you
have only 20ms or 30ms to figure out what might be
wrong with the circuit before both SMPSs are latched
off. In extreme cases, it may be useful to substitute the
MAX1633/MAX1634/MAX1635 into the prototype
breadboard until the prototype is working properly.
Output Overvoltage Protection
(MAX1630/MAX1631/MAX1632)
Both SMPS outputs are monitored for overvoltage. If
either output is more than 7% above the nominal regu-
lation point, both low-side gate drivers (DL_) are
latched high until SHDN or RUN/ON3 is toggled, or until
V+ power is cycled below 1V. This action turns on the
synchronous rectifiers with 100% duty, in turn rapidly
discharging the output capacitors and forcing both
SMPS outputs to ground. The DL outputs are also kept
high whenever the corresponding SMPS is disabled,
and in shutdown if VL is sustained.

MAX1631EAI+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Switching Controllers Multi-Out Low-Noise Power-Supply Ctlr
Lifecycle:
New from this manufacturer.
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