W311
.......................Document #: 38-07703 Rev. ** Page 13 of 18
How to Program CPU Output Frequency
When the programmable output frequency feature is enabled
(Pro_Freq_EN bit is set), the CPU output frequency is deter-
mined by the following equation:
Fcpu = G * (N+3)/(M+3)
“N” and “M” are the values programmed in Programmable
Frequency Select N-Value Register and M-Value Register,
respectively.
“G” stands for the PLL Gear Constant, which is determined by
the programmed value of FS[4:0] or SEL[4:0]. The value is
listed in Table 5. The ratio of (N+3) and (M+3) need to be
greater than “1” [(N+3)/(M+3) > 1].
Table 7 lists set of N and M values for different frequency
output ranges.This example use a fixed value for the M-Value
Register and select the CPU output frequency by changing the
value of the N-Value Register.
FS_Override When Pro_Freq_EN is cleared or disabled,
0 = Select operating frequency by FS input pins (default)
1 = Select operating frequency by SEL bits in SMBus control bytes
When Pro_Freq_EN is set or enabled,
0 = Frequency output ratio between CPU and other frequency groups and the PLL Gear Constant are
based on the latched value of FS input pins (default)
1 = Frequency output ratio between CPU and other frequency groups and the PLL Gear Constant are
based on the programmed value of SEL bits in SMBus control bytes
CPU_FSEL_N,
CPU_FSEL_M
ROCV_FREQ_SEL
When Prog_Freq_EN is set or enabled, the values programmed in CPU_FSEL_N[7:0] and CPU_F-
SEL_M[6:0] determines the CPU output frequency. The new frequency will start to load whenever there
is an update to either CPU_FSEL_N[7:0] or CPU_FSEL_M[6:0]. Therefore, it is recommended to use
Word or Block write to update both registers within the same SMBus bus operation.
The setting of FS_Override bit determines the frequency ratio for CPU, AGP and PCI. When
FS_Override is cleared or disabled, the frequency ratio follows the latched value of the FS input pins.
When FS_Override is set or enabled, the frequency ratio follows the programmed value of SEL bits in
SMBus control bytes.
ROCV_FREQ_SEL determines the source of the recover frequency when a Watchdog Timer timeout
occurs. The clock generator will automatically switch to the recovery CPU frequency based on the
selection on ROCV_FREQ_SEL.
0 = From latched FS[4:0]
1 = From the settings of ROCV_FREQ_N[7:0] & ROCV_FREQ_M[6:0]
WD_PRE_SCALER 0 = 150 ms
1 = 2.5 sec
RST_EN_WD This bit will enable the generation of a Reset pulse when a Watchdog timer time-out occurs.
0 = Disabled
1 = Enabled
RST_EN_FC This bit will enable the generation of a Reset pulse after a frequency change occurs.
0 = Disabled
1 = Enabled
Table 6. Register Summary (continued)
Name Description
Table 7. Examples of N and M Value for Different CPU Frequency Range
Frequency Ranges Gear Constants
Fixed Value for
M-Value Register
Range of N-Value Register
for Different CPU Frequency
50 MHz–129 MHz 48.00741 93 97–255
130 MHz–248 MHz 48.00741 45 127–245
W311
.......................Document #: 38-07703 Rev. ** Page 14 of 18
Absolute Maximum Ratings
[2]
Stresses greater than those listed in this table may cause
permanent damage to the device. These represent a stress
rating only. Operation of the device at these or any other condi-
tions above those specified in the operating sections of this
specification is not implied. Maximum conditions for extended
periods may affect reliability.
.
Parameter Description Rating Unit
V
DD
, V
IN
Voltage on any pin with respect to GND –0.5 to +7.0 V
T
STG
Storage Temperature –65 to +150 °C
T
B
Ambient Temperature under Bias –55 to +125 °C
T
A
Operating Temperature 0 to +70 °C
ESD
PROT
Input ESD Protection 2 (min.) kV
DC Electrical Characteristics: T
A
= 0°C to +70°C, V
DD
= 3.3V±5% and 2.5V±5%
Parameter Description Test Condition Min. Typ. Max. Unit
Supply Current
I
DD
3.3V Supply Current CPU [1:3]=133 MHz
[3]
–260 mA
I
DD
2.5V Supply Current 25 mA
Logic Inputs
V
IL
Input Low Voltage GND – 0.3 0.8 V
V
IH
Input High Voltage 2.0 V
DD
+ 0.3 V
I
IL
Input Low Current
[4]
––25µA
I
IH
Input High Current
[4]
10 µA
Clock Outputs
V
OL
Output Low Voltage I
OL
= 1 mA 50 mV
V
OH
Output High Voltage I
OH
= –1 mA 3.1 V
V
OH
Output Low Voltage CPUT[1:3]
APIC[0:2]
I
OH
= –1 mA 2.2 V
I
OL
Output Low Current CPU1:3 V
OL
= 1.25V 27 57 97 mA
PCI_F, PCI1:8 V
OL
= 1.5V 20.5 53 139 mA
AGP0:2 V
OL
= 1.25V 40 85 140 mA
APIC0:2 V
OL
= 1.25V 40 85 140 mA
REF0:1 V
OL
= 1.5V 25 37 76 mA
48-MHz V
OL
= 1.5V 25 37 76 mA
24-MHz V
OL
= 1.5V 25 37 76 mA
I
OH
Output High Current CPU1:3 V
OH
= 1.25V 25 55 97 mA
PCI_F, PCI1:8 V
OH
= 1.5V 31 55 139 mA
AGP0:2 V
OL
= 1.25V 40 85 140 mA
APIC0:1 V
OH
= 1.5V 27 44 94 mA
48-MHz V
OH
= 1.5V 27 44 94 mA
24-MHz V
OH
= 1.5V 25 37 76 mA
Notes:
2. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
3. All clock outputs loaded with 6" 60 transmission lines with 22-pF capacitors.
4. Inputs have internal pull-up resistors
W311
.......................Document #: 38-07703 Rev. ** Page 15 of 18
AC Electrical Characteristics
T
A
= 0°C to +70°C, V
DD
= 3.3V±5%, V
DD
= 2.5V±5%f
XTL
= 14.31818 MHz
AC clock parameters are tested and guaranteed over stated operating conditions using the stated lump capacitive load at the
clock output; Spread Spectrum is disabled.
Notes:
5. X1 input threshold voltage (typical) is 3.3V/2
6. The W311 contains an internal crystal load capacitor between pin X1 and ground and another between pin X2 and ground. Total load placed on crystal is 18 pF;
this includes typical stray capacitance of short PCB traces to crystal.
7. X1 input capacitance is applicable when driving X1 with an external clock source (X2 is left unconnected).
Crystal Oscillator
V
TH
X1 Input Threshold Voltage
[5]
V
DD
= 3.3V 1.65 V
C
LOAD
Load Capacitance, Imposed on
External Crystal
[6]
–18pF
C
IN,X1
X1 Input Capacitance
[7]
Pin X2 unconnected 28 pF
Pin Capacitance/Inductance
C
IN
Input Pin Capacitance Except X1 and X2 5 pF
C
OUT
Output Pin Capacitance 6 pF
L
IN
Input Pin Inductance 7 nH
DC Electrical Characteristics: T
A
= 0°C to +70°C, V
DD
= 3.3V±5% and 2.5V±5% (continued)
Parameter Description Test Condition Min. Typ. Max. Unit
CPU Clock Outputs (Lump Capacitance Test Load = 20 pF)
Parameter Description
Test Condition
/Comments
CPU = 66.6 MHz CPU = 100 MHz CPU = 133 MHz
UnitMin. Typ. Max. Min. Typ. Max. Min. Typ. Max.
t
P
Period Measured on rising edge at
1.25
15 15.5 10 10.5 7.5 8.0 ns
t
H
High Time Duration of clock cycle
above 2.0V
5.2 3.0 1.87 ns
t
L
Low Time Duration of clock cycle
below 0.4V
5.0 2.8 1.67 ns
t
R
Output Rise Edge
Rate
Measured from 0.4V to
2.0V
14 1–41–4V/ns
t
F
Output Fall Edge
Rate
Measured from 2.0V to
0.4V
14 1–41–4V/ns
t
D
Duty Cycle Measured on rising and
falling edge at 1.25V
45 55 45 55 45 55 %
t
JC
Jitter,
Cycle-to-Cycle
Measured on rising edge at
1.25V. Maximum
difference of cycle time
between two adjacent
cycles.
250 250 250 ps
t
SK
Output Skew Measured on rising edge at
1.25V
175 175 175 ps
f
ST
Frequency
Stabilization from
Power-up (cold start)
Assumes full supply
voltage reached within
1 ms from power-up. Short
cycles exist prior to
frequency stabilization.
3 –3––3ms
Z
o
AC Output
Impedance
Average value during
switching transition. Used
for determining series
termination value.
20 20– –20

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