PCA9535E, PCA9535EC
www.onsemi.com
19
PACKAGE DIMENSIONS
TSSOP24 7.8x4.4, 0.65P
CASE 948H
ISSUE B
DIM
D
MIN MAX
7.90
MILLIMETERS
E1 4.30 4.50
A 1.20
A1 0.05 0.15
L 0.50 0.75
e 0.65 BSC
c 0.09 0.20
b 0.19 0.30
L2 0.25 BSC
M 0 8
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
DAMBAR PROTRUSION SHALL BE 0.08 MAX AT MMC. DAMBAR
CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15
PER SIDE. DIMENSION D IS DETERMINED AT DATUM PLANE H.
5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 PER SIDE. DIMENSION E1 IS DETERMINED
AT DATUM PLANE H.
6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEAT-
ING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.
7.70
---
24X
1.15
24X
0.42
0.65
DIMENSIONS: MILLIMETERS
PITCH
SOLDERING FOOTPRINT
E 6.40 BSC
6.70
RECOMMENDED
L
L2
GAUGE
DETAIL A
PLANE
C
DETAIL A
M
END VIEW
c
H
0.10
SEATING
PLANE
SIDE VIEW
A
C
0.05 C
C
24X
A1
PIN 1
REFERENCE
D
E1
24X b
e
B
M
0.10 AC
TOP VIEW
B0.15
C
112
1324
A
B
NOTE 3
2X 12 TIPS
E
NOTE 6
NOTE 6
NOTE 4
NOTE 5
S S
S
PCA9535E, PCA9535EC
www.onsemi.com
20
PACKAGE DIMENSIONS
WQFN24 4x4, 0.5P
CASE 485BG
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
A
D
E
B
C0.15
PIN ONE
REFERENCE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
K
D2
E2
C
C0.15
C0.10
C0.08
A1
SEATING
PLANE
e
24X
NOTE 3
b
24X
0.10 C
0.05 C
A
BB
DIM MIN MAX
MILLIMETERS
A 0.70 0.80
A1 0.00 0.05
b 0.20 0.30
D 4.00 BSC
D2 2.00 2.20
E 4.00 BSC
E2 2.00 2.20
e 0.50 BSC
K 0.20 −−−
L 0.30 0.50
7
13
19
24X
0.50
PITCH
4.30
0.63
4.30
DIMENSIONS: MILLIMETERS
0.30
24X
1
L
A3 0.20 REF
MOUNTING FOOTPRINT*
NOTE 4
A3
DETAIL B
2.26
2.26
1
PACKAGE
OUTLINE
DETAIL A
e/2
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
L1 0.00 0.15
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
PCA9535E/D
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PCA9535ECMTTXG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Interface - I/O Expanders 16-BIT I/O EXPANDER
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New from this manufacturer.
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