46
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V36100/72V36110 3.3V HIGH DENSITY SUPERSYNC II
TM
36-BIT FIFO
65,536 x 36 and 131,072 x 36
THE INSTRUCTION REGISTER
The Instruction register allows an instruction to be shifted in serially into the
processor at the rising edge of TCLK.
The Instruction is used to select the test to be performed, or the test data
register to be accessed, or both. The instruction shifted into the register is latched
at the completion of the shifting process when the TAP controller is at Update-
IR state.
The instruction register must contain 4 bit instruction register-based cells
which can hold instruction data. These mandatory cells are located nearest the
serial outputs they are the least significant bits.
TEST DATA REGISTER
The Test Data register contains three test data registers: the Bypass, the
Boundary Scan register and Device ID register.
These registers are connected in parallel between a common serial input
and a common serial data output.
The following sections provide a brief description of each element. For a
complete description, refer to the IEEE Standard Test Access Port Specification
(IEEE Std. 1149.1-1990).
TEST BYPASS REGISTER
The register is used to allow test data to flow through the device from TDI
to TDO. It contains a single stage shift register for a minimum length in serial path.
When the bypass register is selected by an instruction, the shift register stage
is set to a logic zero on the rising edge of TCLK when the TAP controller is in
the Capture-DR state.
The operation of the bypass register should not have any effect on the
operation of the device in response to the BYPASS instruction.
THE BOUNDARY-SCAN REGISTER
The Boundary Scan Register allows serial data TDI be loaded in to or read
out of the processor input/output ports. The Boundary Scan Register is a part
of the IEEE 1149.1-1990 Standard JTAG Implementation.
THE DEVICE IDENTIFICATION REGISTER
The Device Identification Register is a Read Only 32-bit register used to
specify the manufacturer, part number and version of the processor to be
determined through the TAP in response to the IDCODE instruction.
IDT JEDEC ID number is 0xB3. This translates to 0x33 when the parity
is dropped in the 11-bit Manufacturer ID field.
For the IDT72V36100/72V36110, the Part Number field contains the
following values:
JTAG INSTRUCTION REGISTER
The Instruction register allows instruction to be serially input into the device
when the TAP controller is in the Shift-IR state. The instruction is decoded to
perform the following:
Select test data registers that may operate while the instruction is
current. The other test data registers should not interfere with chip
operation and the selected data register.
Define the serial test data register path that is used to shift data between
TDI and TDO during data register scanning.
The Instruction Register is a 4 bit field (i.e.IR3, IR2, IR1, IR0) to decode 16
different possible instructions. Instructions are decoded as follows.
Hex Instruction Function
Value
0x00 EXTEST Select Boundary Scan Register
0x02 IDCODE Select Chip Identification data register
0x01 SAMPLE/PRELOAD Select Boundary Scan Register
0x03 HIGH-IMPEDANCE JTAG
0x0F BYPASS Select Bypass Register
Table 6. JTAG Instruction Register Decoding
The following sections provide a brief description of each instruction. For
a complete description refer to the IEEE Standard Test Access Port Specification
(IEEE Std. 1149.1-1990).
EXTEST
The required EXTEST instruction places the IC into an external boundary-
test mode and selects the boundary-scan register to be connected between TDI
and TDO. During this instruction, the boundary-scan register is accessed to
drive test data off-chip via the boundary outputs and receive test data off-chip
via the boundary inputs. As such, the EXTEST instruction is the workhorse of
IEEE. Std 1149.1, providing for probe-less testing of solder-joint opens/shorts
and of logic cluster function.
IDCODE
The optional IDCODE instruction allows the IC to remain in its functional mode
and selects the optional device identification register to be connected between
TDI and TDO. The device identification register is a 32-bit shift register containing
information regarding the IC manufacturer, device type, and version code.
Accessing the device identification register does not interfere with the operation
of the IC. Also, access to the device identification register should be immediately
available, via a TAP data-scan operation, after power-up of the IC or after the
TAP has been reset using the optional TRST pin or by otherwise moving to the
Test-Logic-Reset state.
SAMPLE/PRELOAD
The required SAMPLE/PRELOAD instruction allows the IC to remain in a
normal functional mode and selects the boundary-scan register to be connected
between TDI and TDO. During this instruction, the boundary-scan register can
be accessed via a date scan operation, to take a sample of the functional data
entering and leaving the IC. This instruction is also used to preload test data into
the boundary-scan register before loading an EXTEST instruction.
Device Part# Field
IDT72V36100 04DE
IDT72V36110 04DF
IDT72V36100/72V36110 JTAG Device Identification Register
31(MSB) 28 27 12 11 1 0(LSB)
Version (4 bits) Part Number (16-bit) Manufacturer ID (11-bit)
0X0 0X33 1
47
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V36100/72V36110 3.3V HIGH DENSITY SUPERSYNC II
TM
36-BIT FIFO
65,536 x 36 and 131,072 x 36
HIGH-IMPEDANCE
The optional High-Impedance instruction sets all outputs (including two-state
as well as three-state types) of an IC to a disabled (high-impedance) state and
selects the one-bit bypass register to be connected between TDI and TDO.
During this instruction, data can be shifted through the bypass register from TDI
to TDO without affecting the condition of the IC outputs.
BYPASS
The required BYPASS instruction allows the IC to remain in a normal
functional mode and selects the one-bit bypass register to be connected
between TDI and TDO. The BYPASS instruction allows serial data to be
transferred through the IC from TDI to TDO without affecting the operation of
the IC.
48
CORPORATE HEADQUARTERS for SALES: for Tech Support:
6024 Silver Creek Valley Road 800-345-7015 or 408-284-8200 408-360-1753
San Jose, CA 95138 fax: 408-284-2775 email: FIFOhelp@idt.com
www.idt.com
ORDERING INFORMATION
Thin Plastic Quad Flatpack (PK128, PKG128)
Plastic Ball Grid Array (BB144, BBG144)
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
Low Power
65,536 x 36 3.3V SuperSync II FIFO
131,072 x 36 3.3V SuperSync II FIFO
6117 drw39
Clock Cycle Time (t
CLK
)
Speed in Nanoseconds
Commercial Only, PBGA & TQFP
Com‘l & Ind’l, PBGA & TQFP
Commercial, TQFP Only
Com'l & Ind'l, TQFP Only
6
7-5
10
15
XXXXX
Device Type
X
Power
XX
Speed
X
Package
X
Process /
Temperature
Range
BLANK
I
(1)
72V36100
72V36110
PF
BB
L
X
Green
G
(2)
X
Tray
Tape and Reel
BLANK
8
NOTES:
1. Industrial temperature range product for 7-5ns and 15ns are available as standard device. All other speed grades are available by special order.
2. Green parts are available. For specific speeds and packages contact you sales office.
DATASHEET DOCUMENT HISTORY
05/25/2000 pgs. 1, 6, 7, 8, 34, and 35.
07/28/2000 pgs. 13, 14, and 34.
12/14/2000 pgs. 6, 7, and 8.
03/27/2001 pg. 7.
04/06/2001 pgs. 4, 5, and 18.
12/14/2001 pgs. 1-36.
12/16/2002 pgs. 1-11, 20, 21, 26, and 38-47.
02/11/2003 pgs. 7, and 45.
06/26/2003 pgs. 1, 3, 9, 10, and 47.
07/15/2003 pgs. 3, 20, and 38-40.
07/21/2003 pgs. 7, 43, and 45-47.
09/29/2003 pg. 8.
11/02/2005 pgs. 1, 8-10, and 48.
04/06/2006 pg. 4.
10/22/2008 pg. 48.
12/06/2016 pg. 2, 3, 5, and 48.

72V36100L10PF8

Mfr. #:
Manufacturer:
IDT
Description:
FIFO 64Kx36 3.3V SUPER SYNC II FIFO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union