6.42
IDT70T3509M
High-Speed 2.5V 1024K x 36 Dual-Port Synchronous Static RAM Commercial Temperature Range
22
Identification Register Definitions
Instruction Field
Array
D
Value
Array
D
Instruction Field
Array
C
Value
Array
C
Instruction Field
Array
B
Value
Array
B
Instruction Field
Array
A
Value
Array
A
Description
Revision Number (31:28) 0x0 Revision Number (63:60) 0x0 Revision Number (95:92) 0x0 Revision Number (127:124) 0x0 Reserved for Version number
IDT Device ID (27:12) 0x333 IDT Device ID (59:44) 0x333 IDT Device ID (91:76) 0x333 IDT Device ID (123:108) 0x333 Defines IDT Part number
IDT JEDEC ID (11:1) 0x33 IDT JEDEC ID (43:33) 0x33 IDT JEDEC ID (75:65) 0x33 IDT JEDEC ID (107:97) 0x33 Allows unique identification of device vendor as IDT
ID Register Indicator Bit (Bit 0) 1 ID Register Indicator Bit (Bit 32) 1 ID Register Indicator Bit (Bit 64) 1 ID Register Indicator Bit (Bit 96) 1 Indicates the presence of an ID Register
5682 tbl 16
Scan Register Sizes
System Interface Parameters
NOTES:
1. Device outputs = All device outputs except TDO.
2. Device inputs = All device inputs except TDI, TMS, and TRST.
3. The Boundary Scan Descriptive Language (BSDL) file for this device is available on the IDT website (www.idt.com), or by contacting your local
IDT sales representative.
Register Name
Bit Size
Array A
Bit Size
Array B
Bit Size
Array C
Bit Size
Array D
Bit Size
70T3509M
Instruction (IR) 4 4 4 4 16
Bypass (BYR) 1 1 1 1 4
Identification (IDR) 32323232128
Boundary Scan (BSR) Note (3) Note (3) Note (3) Note (3) Note (3)
5682 tbl 17
Instruction Code Description
EXTEST 0000000000000000 Forces contents of the boundary scan cells onto the device outputs
(1)
.
Places the boundary scan register (BSR) between TDI and TDO.
BYPASS 1111111111111111 Places the bypass register (BYR) between TDI and TDO.
IDCODE 0010001000100010 Loads the ID register (IDR) with the vendor ID code and places the
register between TDI and TDO.
HIGHZ
0100010001000100 Places the bypass register (BYR) between TDI and TDO. Forces all
device output drivers except INTx to a High-Z state.
CLAMP 0011001100110011
Uses BYR. Forces contents of the boundary scan cells onto the device
outputs. Places the bypass register (BYR) between TDI and TDO.
SAMPLE/PRELOAD 0001000100010001 Places the boundary scan register (BSR) between TDI and TDO.
SAMPLE allows data from device inputs
(2)
to be captured in the
boundary scan cells and shifted serially through TDO. PRELOAD allows
data to be input serially into the boundary scan cells via the TDI.
RESERVED 0101010101010101, 0111011101110111,
1000100010001000, 1001100110011001,
1010101010101010, 1011101110111011,
1100110011001100
Several combinations are reserved. Do not use codes other than those
identified above.
PRIVATE 0110011001100110,1110111011101110,
1101110111011101
For internal use only.
5682 tbl 18
6.42
IDT70T3509M
High-Speed 2.5V 1024K x 36 Dual-Port Synchronous Static RAM Commercial Temperature Range
23
Ordering Information
Datasheet Document History:
11/09/04: Initial Public Release of Preliminary Datasheet
03/24/05: Page 1 Added I-temp offering to features
Page 6 Added I-temp information to the Recommended Operating Temperature and Supply Voltage table
Page 8 Added I-temp values to the DC Electrical Characteristics table
Page 10 Added I-temp to the heading of the AC Electrical Characteristics table
Page 23 Added I-temp to ordering information
Page 1 Added green availability to features
Page 1 - 23 Removed Preliminary status
06/14/05: Page 1 Added feature to highlight footprint compatibility
Page 3 & 23 Added a footnote to highlight package thickness of BP-256 vs. BC-256
08/27/07: Page 1 Functional Block Diagram changed to correct chip enable logic and added footnote 2 referencing Truth Table I
07/28/08: Page 8 Corrected a typo in the DC Chars table
01/19/09: Page 23 Removed "IDT" from orderable part number
07/15/14: Page 23 Added Tape & Reel to Ordering Information
NOTES:
1. Contact your local sales office for Industrial temp range in other speeds, packages and powers.
2. Green parts available. For specific speeds, packages and powers contact your local sales office
.
3. BP-256 package thickness is 1.76mm nominal. This is thicker than the BC-256 package (1.40mm nominal) used for the lower density IDT dual-port products.
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
CORPORATE HEADQUARTERS for SALES: for Tech Support:
6024 Silver Creek Valley Road 800-345-7015 or 408-284-8200 408-284-2794
San Jose, CA 95138 fax: 408-284-2775 DualPortHelp@idt.com
www.idt.com
A
Power
999
Speed
A
Package
A
Process/
Temperature
Range
XXXXX
Device
Type
Blank
I
BB
166
133
70T3719M
70T3799M
S
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
324-pin BGA (BBG-324)
18Mbit (256K x 72)
2.5V
Synchronous Dual-Port RAM
9Mbit (128K x 72)
2.5V
Synchronous Dual-Port RAM
Standard Power
Speed in Megahertz
Commercial Only
Commercial & Industrial
5687 drw 26
G
(1)
Green
A
A
Tube or Tray
Tape and Reel
Blank
8

70T3509MS133BPGI

Mfr. #:
Manufacturer:
IDT
Description:
SRAM 1024Kx36 STD-PWR 2.5V DUAL PORT RAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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