6.42
IDT70T3509M
High-Speed 2.5V 1024K x 36 Dual-Port Synchronous Static RAM Commercial Temperature Range
4
Pin Names
Left Port Right Port Names
CE
0L
,
CE
1L
CE
0R
,
CE
1R
Chip Enables (Input)
(5)
R/W
L
R/W
R
Read/Write Enable (Input)
OE
L
OE
R
Output Enable (Input)
A
0L
- A
19L
A
0R
- A
19R
Address (Input)
I/O
0L
- I/O
35L
I/O
0R
- I/O
35R
Data Input/Output
CLK
L
CLK
R
Clock (Input)
PL/FT
L
PL/FT
R
Pipeline/Flow-Through (Input)
ADS
L
ADS
R
Address Strobe Enable (Input)
CNTEN
L
CNTEN
R
Counter Enable (Input)
REPEAT
L
REPEAT
R
Counter Repeat
(3)
(Input)
BE
0L
- BE
3L
BE
0R
- BE
3R
Byte Enables (9-bit bytes) (Input)
(5)
V
DDQL
V
DDQR
Power (I/O Bus) (3.3V or 2.5V)
(1)
(Input)
OPT
L
OPT
R
Option for selecting V
DDQX
(1,2)
(Input)
ZZ
L
ZZ
R
Sleep Mode pin
(4)
(Input)
V
DD
Power (2.5V)
(1)
(Input)
V
SS
Ground (0V) (Input)
TDI Test Data Input
TDO Test Data Output
TCK Test Logic Clock (10MHz) (Input)
TMS Test Mode Select (Input)
TRST
Reset (Initialize TAP Controller) (Input)
INT
L
INT
R
Interrupt Flag (Output)
5682 tbl 01
NOTES:
1. V
DD, OPTX, and VDDQX must be set to appropriate operating levels prior to
applying inputs on the I/Os and controls for that port.
2. OPT
X selects the operating voltage levels for the I/Os and controls on that port.
If OPT
X is set to VDD (2.5V), then that port's I/Os and controls will operate at 3.3V
levels and V
DDQX must be supplied at 3.3V. If OPTX is set to VSS (0V), then that
port's I/Os and address controls will operate at 2.5V levels and V
DDQX must be
supplied at 2.5V. The OPT pins are independent of one another—both ports can
operate at 3.3V levels, both can operate at 2.5V levels, or either can operate
at 3.3V with the other at 2.5V.
3. When REPEAT
X is asserted, the counter will reset to the last valid address loaded
via ADS
X.
4. The sleep mode pin shuts off all dynamic inputs, except JTAG inputs, when
asserted. All static inputs, i.e., PL/FTx and OPTx and the sleep mode pins
themselves (ZZx) are not affected during sleep mode. It is recommended that
boundary scan not be operated during sleep mode.
5. Chip Enables and Byte Enables are double buffered when PL/FT = V
IH, i.e., the
signals take two cycles to deselect.
6.42
IDT70T3509M
High-Speed 2.5V 1024K x 36 Dual-Port Synchronous Static RAM Commercial Temperature Range
5
NOTES:
1. "H" = V
IH, "L" = VIL, "X" = Don't Care.
2. ADS, CNTEN, REPEAT = X.
3. OE and ZZ are asynchronous input signals.
4. It is possible to read or write any combination of bytes during a given access. A few representative samples have been illustrated here.
Truth Table I—Read/Write and Enable Control
(1,2,3,4)
OE
CLK
CE
0
CE
1
BE
3
BE
2
BE
1
BE
0
R/W ZZ
Byte 3
I/O
27-35
Byte 2
I/O
18-26
Byte 1
I/O
9-17
Byte 0
I/O
0-8
MODE
X
HLXXXXXLHigh-ZHigh-ZHigh-ZHigh-ZDeselectedPower Down
X
LLXXXXXXActiveActiveActiveActiveNot Allowed
X
HHXXXXXXActiveActiveActiveActiveNot Allowed
X
L H H H H H X L High-Z High-Z High-Z High-Z All Bytes Deselected
X
L H H H H L L L High-Z High-Z High-Z D
IN
Write to Byte 0 Only
X
L H H H L H L L High-Z High-Z D
IN
High-Z Write to Byte 1 Only
X
LHHLHHLLHigh-Z D
IN
High-Z High-Z Write to Byte 2 Only
X
LHLHHHLL D
IN
High-Z High-Z High-Z Write to Byte 3 Only
X
L H H H L L L L High-Z High-Z D
IN
D
IN
Write to Lower 2 Bytes Only
X
LHLLHHLL D
IN
D
IN
High-Z High-Z Write to Upper 2 bytes Only
X
LHLLLLLL D
IN
D
IN
D
IN
D
IN
Write to All Bytes
L
L H H H H L H L High-Z High-Z High-Z D
OUT
Read Byte 0 Only
L
L H H H L H H L High-Z High-Z D
OUT
High-Z Read Byte 1 Only
L
LHHLHHHLHigh-Z D
OUT
High-Z High-Z Read Byte 2 Only
L
LHLHHHHL D
OUT
High-Z High-Z High-Z Read Byte 3 Only
L
L H H H L L H L High-Z High-Z D
OUT
D
OUT
Read Lower 2 Bytes Only
L
LHLLHHHL D
OUT
D
OUT
High-Z High-Z Read Upper 2 Bytes Only
L
LHLLLLHL D
OUT
D
OUT
D
OUT
D
OUT
Read All Bytes
H
XXXXXXX LHigh-ZHigh-ZHigh-ZHigh-ZOutputs Disabled
XXXXXXXXXHHigh-ZHigh-ZHigh-ZHigh-ZSleep Mode
5682 tbl 02
Truth Table II—Address Counter Control
(1,2)
NOTES:
1. "H" = V
IH, "L" = VIL, "X" = Don't Care.
2. Read and write operations are controlled by the appropriate setting of R/W, CE
0, CE1, BEn and OE.
3. Outputs configured in flow-through output mode: if outputs are in pipelined mode the data out will be delayed by one cycle.
4. ADS and REPEAT are independent of all other memory control signals including CE
0, CE1 and BEn
5. The address counter advances if CNTEN = V
IL on the rising edge of CLK, regardless of all other memory control signals including CE0, CE1, BEn.
6. When REPEAT is asserted, the counter will reset to the last valid address loaded via ADS. This value is not set at power-up: a known location should be loaded
via ADS during initialization if desired. Any subsequent ADS access during operations will update the REPEAT address location.
7. Address A
19 must be managed as part of a full depth counter implementation using the IDT70T3509M. For physical addresses 00000H through 7FFFFH the value
of a A
19 is 0, while for physical addresses 80000H through FFFFFH the value of A19 is 1. The user needs to keep track of the device counter and make sure that
A
19 is actively driven from 0-to-1 or 1-to-0 and held as needed at the appropriate address boundaries for full depth counter operation and that A19 is in the appropriate
state when using the REPEAT function.
Address
Previous
Internal
Address
Internal
Address
Used CLK
ADS CNTEN REPEAT
(6)
I/O
(3)
MODE
An X An
L
(4)
XHD
I/O
(n) External Address Used
XAnAn + 1
H L
(5)
HD
I/O
(n+1) Counter Enabled—Internal Address generation
(7)
XAn + 1An + 1
HH HD
I/O
(n+1) External Address Blocked—Counter disabled (An + 1 reused)
XXAn
XX L
(4)
D
I/O
(n) Counter Set to last valid ADS load
5682 tbl 03
6.42
IDT70T3509M
High-Speed 2.5V 1024K x 36 Dual-Port Synchronous Static RAM Commercial Temperature Range
6
Recommended Operating
Temperature and Supply Voltage
(1)
NOTES:
1. This is the parameter TA. This is the "instant on" case temperature.
Grade
Ambient
Temperature GND V
DD
Commercial 0
O
C to +70
O
C0V2.5V
+
100mV
Industrial -40
O
C to +85
O
C0V2.5V
+
100mV
5682 tbl 04
Recommended DC Operating
Conditions with V
DDQ at 3.3V
NOTES:
1. V
IL (min.) = -1.0V for pulse width less than tCYC/2, or 5ns, whichever is less.
2. V
IH (max.) = VDDQ + 1.0V for pulse width less than tCYC/2 or 5ns, whichever is less.
3. To select operation at 3.3V levels on the I/Os and controls of a given port, the OPT pin
for that port must be set to V
DD (2.5V), and VDDQX for that port must be supplied as indicated
above.
Symbol Parameter Min. Typ. Max. Unit
V
DD
Core Supply Voltage 2.4 2.5 2.6 V
V
DDQ
I/O Supply Voltage
(3)
3.15 3.3 3.45 V
V
SS
Ground 0 0 0 V
V
IH
Input High Voltage
(Address, Control
&Data I/O Inputs)
(3)
2.0
____
V
DDQ
+ 150mV
(2)
V
V
IH
Input High Voltage
_
JTAG
1.7
____
V
DD
+ 100mV
(2)
V
V
IH
Input High Voltage -
ZZ, OPT, PIPE/FT
V
DD
- 0.2V
____
V
DD
+ 100mV
(2)
V
V
IL
Input Low Voltage -0.3
(1)
____
0.8 V
V
IL
Input Low Voltage -
ZZ, OPT, PIPE/FT
-0.3
(1)
____
0.2 V
5682 tbl 05b
Recommended DC Operating
Conditions with V
DDQ at 2.5V
NOTES:
1. V
IL (min.) = -1.0V for pulse width less than tCYC/2 or 5ns, whichever is less.
2. V
IH (max.) = VDDQ + 1.0V for pulse width less than tCYC/2 or 5ns, whichever is less.
3. To select operation at 2.5V levels on the I/Os and controls of a given port, the OPT
pin for that port must be set to V
ss(0V), and VDDQX for that port must be supplied as indicated
above.
Symbol Parameter Min. Typ. Max. Unit
V
DD
Core Supply Voltage 2.4 2.5 2.6 V
V
DDQ
I/O Supply Voltage
(3)
2.4 2.5 2.6 V
V
SS
Ground 0 0 0 V
V
IH
Input High Volltage
(Address, Control &
Data I/O Inputs)
(3)
1.7
____
V
DDQ
+ 100mV
(2)
V
V
IH
Input High Voltage
_
JTAG
1.7
____
V
DD
+ 100mV
(2)
V
V
IH
Input High Voltage -
ZZ, OPT, PIPE/FT
V
DD
- 0.2V
____
V
DD
+ 100mV
(2)
V
V
IL
Input Low Voltage -0.3
(1)
____
0.7 V
V
IL
Input Low Voltage -
ZZ, OPT, PIPE/FT
-0.3
(1)
____
0.2 V
5682 tbl 05a

70T3509MS133BPGI

Mfr. #:
Manufacturer:
IDT
Description:
SRAM 1024Kx36 STD-PWR 2.5V DUAL PORT RAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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