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LTC1403AIMSE#TRPBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22
LTC1403/LTC1403A
19
1403fc
For more information www.linear.com/LTC1403
applications inFormation
; * DO NOT MODIFY THESE FOUR VECTORS IF YOU PLAN TO USE THE DEBUGGER *
; All other vector locations are free to use. When programming always be sure
; the HPIINT bit is unmasked (IMR=200h) to allow the communications kernel and
; host PC interact. INT2 should normally be masked (IMR(bit 2) = 0) so that the
; DSP will not interrupt itself during a HINT. HINT is tied to INT2 externally.
;
;
;
.title “Vector Table”
.mmregs
reset goto #80h ;00; RESET * DO NOT MODIFY IF USING DEBUGGER *
nop
nop
nmi return _ enable ;04; non-maskable external interrupt
nop
nop
nop
trap2 goto #88h ;08; trap2 * DO NOT MODIFY IF USING DEBUGGER *
nop
nop
.space 52*16 ;0C-3F: vectors for software interrupts 18-30
int0 return _ enable ;40; external interrupt int0
nop
nop
nop
int1 return _ enable ;44; external interrupt int1
nop
nop
nop
int2 return _ enable ;48; external interrupt int2
nop
nop
nop
tint return _ enable ;4C; internal timer interrupt
nop
nop
nop
brint goto breceive ;50; BSP receive interrupt
nop
nop
nop
bxint goto bsend ;54; BSP transmit interrupt
nop
nop
nop
trint return _ enable ;58; TDM receive interrupt
nop
nop
nop
txint return _ enable ;5C; TDM transmit interrupt
nop
nop
int3 return _ enable ;60; external interrupt int3
nop
nop
nop
hpiint dgoto #0e4h ;64; HPIint * DO NOT MODIFY IF USING DEBUGGER *
nop
nop
.space 24*16 ;68-7F; reserved area
LTC1403/LTC1403A
20
1403fc
For more information www.linear.com/LTC1403
package Description
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev I)
Please refer to http://www.linear.com/product/LTC1403#packaging for the most recent package drawings.
MSOP (MSE) 0213 REV I
0.53 ±0.152
(.021 ±.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2
3
4 5
4.90 ±0.152
(.193 ±.006)
0.497 ±0.076
(.0196 ±.003)
REF
8910
10
1
7
6
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
0.254
(.010)
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ±0.127
(.035 ±.005)
RECOMMENDED SOLDER PAD LAYOUT
1.68 ±0.102
(.066 ±.004)
1.88 ±0.102
(.074 ±.004)
0.50
(.0197)
BSC
0.305 ± 0.038
(.0120 ±.0015)
TYP
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.68
(.066)
1.88
(.074)
0.1016 ±0.0508
(.004 ±.002)
DETAIL “B”
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.05 REF
0.29
REF
LTC1403/LTC1403A
21
1403fc
For more information www.linear.com/LTC1403
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
revision history
REV DATE DESCRIPTION PAGE NUMBER
C 02/17 Updated Timing Characteristics Including t
CONV
Minimum Conversion Time of 17 Clocks 5, 9, 14, 15
(Revision history begins at Rev C)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22

LTC1403AIMSE#TRPBF

Mfr. #:
Buy LTC1403AIMSE#TRPBF
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC Serial 14-B, 2.8Msps Smpl ADCs w/ SD
Lifecycle:
New from this manufacturer.
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