NCP4308
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22
The absolute minimum t
ON
duration is internally clamped
to 55 ns and minimum t
OFF
duration to 245 ns in order to
prevent any potential issues with the MIN_TON and/or
MIN_TOFF pins being shorted to GND.
The NCP4308 features dedicated anti−ringing protection
system that is implemented with a MIN_TOFF blank
generator. The minimum off−time one−shot generator is
restarted in the case when the CS pin voltage crosses
V
TH_CS_RESET
threshold and MIN_TOFF period is active.
The total off-time blanking period is prolonged due to the
ringing in the application (refer to Figure 37).
Some applications may require adaptive minimum on and
off time blanking periods. With NCP4308 it is possible to
modulate blanking periods by using an external NPN
transistor − refer to Figure 48. The modulation signal can be
derived based on the load current, feedback regulator
voltage or other application parameter.
Figure 48. Possible Connection for MIN_T
ON
and MIN_T
OFF
Modulation
Maximum t
ON
adjustment
The NCP4308Q offers an adjustable maximum on−time
(like the min_t
ON
and min_t
OFF
settings shown above) that
can be very useful for QR controllers at high loads. Under
high load conditions the QR controller can operate in CCM
thanks to this feature. The NCP4308Q version has the ability
to turn−off the DRV signal to the SR MOSFET before the
secondary side current reaches zero. The DRV signal from
the NCP4308Q can be fed to the primary side through a
pulse transformer (see Figure 4 for detail) to a transistor on
the primary side to emulate a ZCD event before an actual
ZCD event occurs. This feature helps to keep the minimum
switching frequency up so that there is better energy transfer
through the transformer (a smaller transformer core can be
used). Also another advantage is that the IC controls the SR
MOSFET and turns off from secondary side before the
primary side is turned on in CCM to ensure no cross
conduction. By controlling the SR MOSFET’s turn off
before the primary side turn off, producing a zero cross
conduction operation, this will improve efficiency.
The Internal connection of the MAX_TON feature is
shown in Figure 49. Figure 49 shows a method that allows
for a modification of the maximum on−time according to
output voltage. At a lower V
OUT
, caused by hard overload
or at startup, the maximum on−time should be longer than at
nominal voltage. Resistor R
A
can be used to modulate
maximum on−time according to V
OUT
or any other
parameter.
The operational waveforms at heavy load in QR type
SMPS are shown in Figure 50. After t
MAX_TON
time is
exceeded, the synchronous switch is turned off and the
secondary current is conducted by the diode. Information
about turned off SR MOSFET is transferred by the DRV pin
through a small pulse transformer to the primary side where
it acts on the ZCD detection circuit to allow the primary
switch to be turned on. Secondary side current disappears
before the primary switch is turned on without a possibility
of cross current condition.
NCP4308
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23
Figure 49. Internal Connection of the MAX_TON Generator, NCP4308Q
V
DS
=V
CS
V
TH_CS _RESET
–(R
SHIFT_CS
*I
CS
)
V
TH_CS_OFF
–(R
SHIFT_CS
*I
CS
)
V
TH_CS_ON
–(R
SHIFT_CS
*I
CS
)
V
DRV
Min ON−time
t
Min OFFtime
t
MIN_TON
t
MIN_TOFF
I
SEC
The t
MIN _TON
and t
MIN_TOFF
are adjustable by R
MIN_TON
and R
MIN_TOFF
resistors, t
MAX_TON
is adjustable by R
MAX_TON
Turnon delay
Turnoff delay
Primary virtual ZCD
detection delay
Max ONtime
t
MAX _TON
Figure 50. Function of MAX_TON Generator in Heavy Load Condition
NCP4308
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24
Power Dissipation Calculation
It is important to consider the power dissipation in the
MOSFET driver of a SR system. If no external gate resistor
is used and the internal gate resistance of the MOSFET is
very low, nearly all energy losses related to gate charge are
dissipated in the driver. Thus it is necessary to check the SR
driver power losses in the target application to avoid over
temperature and to optimize efficiency.
In SR systems the body diode of the SR MOSFET starts
conducting before SR MOSFET is turned−on, because there
is some delay from V
TH_CS_ON
detect to turn−on the driver.
On the other hand, the SR MOSFET turn off process always
starts before the drain to source voltage rises up
significantly. Therefore, the MOSFET switch always
operates under Zero Voltage Switching (ZVS) conditions
when in a synchronous rectification system.
The following steps show how to approximately calculate
the power dissipation and DIE temperature of the NCP4308
controller. Note that real results can vary due to the effects
of the PCB layout on the thermal resistance.
Step 1 − MOSFET Gate−to Source Capacitance:
During ZVS operation the gate to drain capacitance does
not have a Miller effect like in hard switching systems
because the drain to source voltage does not change (or its
change is negligible).
Figure 51. Typical MOSFET Capacitances
Dependency on V
DS
and V
GS
Voltages
C
iss
+ C
gs
) C
gd
C
rss
+ C
gd
C
oss
+ C
ds
) C
gd
Therefore, the input capacitance of a MOSFET operating
in ZVS mode is given by the parallel combination of the gate
to source and gate to drain capacitances (i.e. C
iss
capacitance
for given gate to source voltage). The total gate charge,
Q
g_total
, of most MOSFETs on the market is defined for hard
switching conditions. In order to accurately calculate the
driving losses in a SR system, it is necessary to determine the
gate charge of the MOSFET for operation specifically in a
ZVS system. Some manufacturers define this parameter as
Q
g_ZVS
. Unfortunately, most datasheets do not provide this
data. If the C
iss
(or Q
g_ZVS
) parameter is not available then
it will need to be measured. Please note that the input
capacitance is not linear (as shown Figure 51) and it needs
to be characterized for a given gate voltage clamp level.
Step 2 − Gate Drive Losses Calculation:
Gate drive losses are affected by the gate driver clamp
voltage. Gate driver clamp voltage selection depends on the
type of MOSFET used (threshold voltage versus channel
resistance). The total power losses (driving loses and
conduction losses) should be considered when selecting the
gate driver clamp voltage. Most of today’s MOSFETs for SR
systems feature low R
DS(on)
for 5 V V
GS
voltage. The
NCP4308 offers both a 5 V gate clamp and a 10 V gate
clamp for those MOSFET that require higher gate to source
voltage.
The total driving loss can be calculated using the selected
gate driver clamp voltage and the input capacitance of the
MOSFET:
P
DRV_total
+ V
CC
@ V
CLAMP
@ C
g_ZVS
@ f
SW
(eq. 9)
Where:
V
CC
is the NCP4308 supply voltage
V
CLAMP
is the driver clamp voltage
C
g_ZVS
is the gate to source capacitance of the
MOSFET in ZVS mode
f
sw
is the switching frequency of the target
application
The total driving power loss won’t only be dissipated in
the IC, but also in external resistances like the external gate
resistor (if used) and the MOSFET internal gate resistance
(Figure 50). Because NCP4308 features a clamped driver,
it’s high side portion can be modeled as a regular driver
switch with equivalent resistance and a series voltage
source. The low side driver switch resistance does not drop
immediately at turn−off, thus it is necessary to use an
equivalent value (R
DRV_SIN_EQ
) for calculations. This
method simplifies power losses calculations and still
provides acceptable accuracy. Internal driver power
dissipation can then be calculated using Equation 10:

NCP4308QDR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Switching Controllers SYNCHRONOUS RECTIFIER CON
Lifecycle:
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