NCP4308
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PIN FUNCTION DESCRIPTION
ver. A, B, C, D ver. Q Pin Name Description
1 1 VCC Supply voltage pin
2 2 MIN_TOFF Adjust the minimum off time period by connecting resistor to ground.
3 3 MIN_TON Adjust the minimum on time period by connecting resistor to ground.
4 4 NC Leave this pin opened or tie it to ground.
5 NC Leave this pin opened or tie it to ground.
6 6 CS Current sense pin detects if the current flows through the SR MOSFET and/or its body
diode. Basic turn−off detection threshold is 0 mV. A resistor in series with this pin can
decrease the turn off threshold if needed.
7 7 GND Ground connection for the SR MOSFET driver, V
CC
decoupling capacitor and for mini-
mum on and off time adjust resistors. GND pin should be wired directly to the SR
MOSFET source terminal/soldering point using Kelvin connection. DFN8 exposed flag
should be connected to GND
8 8 DRV Driver output for the SR MOSFET
5 MAX_TON Adjust the maximum on time period by connecting resistor to ground.
Minimum ON time
generator
MIN_TON
CS
detection
100mA
CS
MIN_TOFF
NC
CS_ON
CS_OFF
DRV
VCC
GND
V
CC
managment
UVLO
DRV Out
DRIVER
V
DD
V
DD
CS_RESET
NCADJ
ELAPSED
EN
Minimum OFF
time generator
ADJ
RESET
ELAPSED
Control logic
EN
Figure 5. Internal Circuit Architecture − NCP4308A, B, C, D
NCP4308
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5
Minimum ON time
generator
MIN_TON
CS
detection
100mA
CS
MIN_TOFF
MAX_TON
CS_ON
CS_OFF
DRV
VCC
GND
V
CC
managment
UVLO
DRV Out
DRIVER
V
DD
V
DD
CS_RESET
NC
ADJ
ELAPSED
EN
Minimum OFF
time generator
ADJ
RESET
ELAPSED
Control logic
EN
ELAPSED
Maximum ON time
generator
EN
ADJ
Figure 6. Internal Circuit Architecture − NCP4308Q (CCM QR) with MAX_TON
NCP4308
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ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Supply Voltage V
CC
−0.3 to 37.0 V
MIN_TON, MIN_TOFF, MAX_TON Input Voltage V
MIN_TON
,
V
MIN_TOFF
,
V
MAX_TON
−0.3 to V
CC
V
Driver Output Voltage V
DRV
−0.3 to 17.0 V
Current Sense Input Voltage V
CS
−4 to 150 V
Current Sense Dynamic Input Voltage (t
PW
= 200 ns) V
CS_DYN
−10 to 150 V
MIN_TON, MIN_TOFF, MAX_TON, Input Current I
MIN_TON
, I
MIN_TOFF
,
I
MAX_TON
−10 to 10 mA
Junction to Air Thermal Resistance, 1 oz 1 in
2
Copper Area, SOIC8
R
q
J−A_SOIC8
160 °C/W
Junction to Air Thermal Resistance, 1 oz 1 in
2
Copper Area, DFN8
R
q
J−A_DFN8
80 °C/W
Junction to Air Thermal Resistance, 1 oz 1 in
2
Copper Area, WDFN8
R
q
J−A_WDFN8
160 °C/W
Maximum Junction Temperature T
JMAX
150 °C
Storage Temperature T
STG
−60 to 150 °C
ESD Capability, Human Body Model, Except Pin 6, per JESD22−A114E ESD
HBM
2000 V
ESD Capability, Human Body Model, Pin 6, per JESD22−A114E ESD
HBM
1000 V
ESD Capability, Machine Model, per JESD22−A115−A ESD
MM
200 V
ESD Capability, Charged Device Model, Except Pin 6, per JESD22−C101F ESD
CDM
750 V
ESD Capability, Charged Device Model, Pin 6, per JESD22−C101F ESD
CDM
250 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device meets latch−up tests defined by JEDEC Standard JESD78D Class I.
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Min Max Unit
Maximum Operating Input Voltage V
CC
35 V
Operating Junction Temperature T
J
−40 125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.

NCP4308QDR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Switching Controllers SYNCHRONOUS RECTIFIER CON
Lifecycle:
New from this manufacturer.
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