Data Sheet ADuCM310
Rev. A Page 27 of 27
OUTLINE DIMENSIONS
6.10
6.00 SQ
5.90
5.00
REF SQ
0.35
0.30
0.25
04-02-2013-A
COMPLIANT TO JEDEC STANDARDS MO-195-AC
WITH THE EXCEPTION TO BALL COUNT.
COPLANARITY
0.08
0.26
REF
A
B
C
D
E
F
G
H
J
K
L
7
6
3
2 1
5
4
BALL DIAMETER
0.50
BSC
0.50
REF
DETAIL A
A1 BALL
CORNER
A1 BALL
CORNER
DETAIL A
BOTTOM VIEW
TOP VIEW
SEATING
PLANE
0.93
0.86
0.79
1.200
1.083
1.000
0.223 NOM
0.173 MIN
89
1011
Figure 25. 112-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-112-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADuCM310BBCZ −10°C to +85°C 112-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-112-4
ADuCM310BBCZ-RL 10°C to +85°C 112-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-112-4
EVAL-ADuCM310QSPZ Evaluation Board with QuickStart Development System
1
Z = RoHS Compliant Part.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13040-0-11/15(A)

ADUCM310BBCZ-RL

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
ARM Microcontrollers - MCU 80Mhz M3 wi 14Bit Analog for TSFP+ (Fin)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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