NCN8024
http://onsemi.com
10
SMART CARD INTERFACE SECTION, CRD_IO, CRD_AUX1, CRD_AUX2, CRD_CLK, CRD_RST, CRD_PRES,
CRD_PRES
(V
DD
= 3.3 V; V
DDP
= 5 V; T
amb
= 25°C; F
CLKIN
= 10 MHz)
Pin UnitMaxTypMinRatingSymbol
9, 10
|I
IH
|
|I
IL
|
CRD_PRES, CRD_PRES
High level input leakage current, V
IH
= V
DD
CRD_PRES
CRD_PRES
Low level input leakage current, V
IL
= 0 V
CRD_PRES
CRD_PRES
5
5
10
1
1
10
mA
9, 10 T
debounce
Debounce Time CRD_PRES and CRD_PRES (Note 7) 5 8 11 ms
11, 12,
13, 16
I
CRD_IO
CRD_IO, CRD_AUX1, CRD_AUX2 Current Limitation 15 mA
15 I
CRD_CLK
CRD_CLK Current Limitation 70 mA
16 I
CRD_RST
CRD_RST Current Limitation 20 mA
t
act
Activation Time (Note 7) 30 100
ms
t
deact
Deactivation Time (Note 7) 30 250
ms
Temp
SD
Shutdown Temperature 160 °C
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed
circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the
declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device
specification limit values are applied individually under normal operating conditions and not valid simultaneously.
7. Guaranteed by design and characterization
POWER SUPPLY
The NCN8024 smart card interface has two power
supplies: V
DD
and V
DDP
.
V
DD
is usually common to the system controller and the
interface. The applied V
DD
ranges from 2.7 V up to 5.5 V.
If V
DD
goes below 2.35 V typical (UVLO
VDD
) a
powerdown sequence is automatically performed. In that
case the interrupt (INT) pin is set Low.
A builtin chargepumpbased DC/DC converter
followed by a Low DropOut (LDO) regulator is used to
provide the 3 V or 5 V power supply voltage (CRD_V
CC
) to
the card. V
DDP
is the converters input voltage. VUP is the
chargepump converters output. It is connected to the LDO
input. A reservoir capacitor of 100 nF is connected to VUP.
CRD_V
CC
is the LDO output. Even if the converter can
operate with a single output reservoir capacitor as low as
100 nF at CRD_V
CC
, it is recommended to use a capacitor
of at least 320 nF in order to satisfy the datasheet
specifications. The best recommended combination
guaranteeing optimal performances consists in a distributed
set of capacitors 220 nF + 330 nF (in particular
recommended for optimally satisfying the NDS standard).
To minimize dI/dt effects, the fly capacitor (100 nF) and the
reservoir capacitors VUP and CRD_V
CC
have to be
connected as close as possible to the corresponding device’s
pin and feature very low ESR values (lower than 50 mW).
The fly capacitor is connected between C1 and C2. The
decoupling capacitors on V
DD
and V
DDP
respectively
100 nF and 10 mF have also to be connected close to the
respective IC pins.
The CRD_VCC pin can source up to 75 mA continuously
over the V
DDP
range (from 3.3 V to 5.5 V), the absolute
maximum current being internally limited below 150 mA
(Typical at 110 mA). CRD_VCC can stay in the range 4.6 V
5.30 V during current transient up to 200 mA (peak
current) over less than 400 ns of current pulse duration such
as the charge transient is lower than 40 nAs.
There’s no specific sequence for applying V
DD
or V
DDP
.
They can be applied to the interface in any sequence. After
powering the device INT remains Low until a card is
inserted.
SUPPLY VOLTAGE MONITORING
The supply voltage monitoring block includes the Power
On Reset (POR) circuitry and the under voltage lockout
(UVLO) detection (V
DD
voltage dropout detection).
PORADJ pin allows the user, according to the considered
application, to adjust the V
DD
UVLO threshold. If not used
PORADJ pin is connected to Ground.
The input supply voltage is continuously monitored to
prevent under voltage operation. At power up, the system
initializes the internal logic during POR timing and no
further signal can be provided or supported during this
period. Such initialization takes place when the input
voltage rises between 2 V to 2.6 V about typical.
The system is ready to operate when the input voltage has
reached the minimum 2.7 V. Considering this, the NCN8024
will detect an UnderVoltage situation when the input
supply voltage will drop below 2.35 V typical. When V
DD
goes down below the UVLO falling threshold a deactivation
sequence is performed.
The device is inactive during poweron and poweroff of
the V
DD
supply (8 ms reset pulse).
NCN8024
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11
PORADJ pin is used to modify the UVLO threshold
according to the below relationship considering an external
resistor divider R1 / R2 (see block diagram Figure 1):
UVLO +
R1 ) R2
R2
V
POR
If PORADJ is connected to Ground the V
DD
UVLO
threshold (V
DD
falling) is typically 2.35 V. In some cases it
can be interesting to adjust this threshold at a higher value
and by the way increase the V
DD
supply dropout detection
level which enables a deactivation sequence if the V
DD
voltage is too low.
For example, there are microcontrollers for which the
minimum supply voltage insuring a correct operating is
higher than 2.55 V, increasing UVLO
VDD
(V
DD
falling) is
consequently necessary. Considering for instance a resistor
bridge with R1 = 56 kW, R2 = 42 kW and V
POR
= 1.18 V
typical the V
DD
dropout detection level can be increased up to:
UVLO +
59k ) 42k
42k
V
POR
+ 2.75 V
The minimum dropout detection voltage should be higher
than 2 V.
The maximum detection level may be up to VDD.
CLOCK DIVIDER:
The input clock can be divided by 1/1, 1/2, 1/4, or 1/8,
depending upon the specific application, prior to be applied
to the smart card driver. These division ratios are
programmed using pins CLKDIV1 and CLKDIV2 (see
Table 1). The input clock is provided externally to pin
CLKIN.
Table 1. Clock Frequency Programming
CLKDIV1 CLKDIV2 F
CRD_CLK
0 0 CLKIN/8
0 1 CKLKIN / 4
1 0 CLKIN
1 1 CLKIN / 2
The clock input stage (CLKIN) can handle a 27 MHz
maximum frequency signal (considering a division ratio w
2). Of course, the ratio must be defined by the user to cope
with Smart Card considered in a given application
In order to avoid any duty cycle out of the 45% / 55%
range specification, the divider is synchronized by the last
flip flop, thus yielding a constant 50% duty cycle, whatever
be the divider ratio 1/2, 1/4 or 1/8. On the other hand, the
output signal Duty Cycle cannot be guaranteed 50% if the
division ratio is 1 and if the input Duty Cycle signal is not
within the 46 56% range at the CLKIN input.
When the signal applied to CLKIN is coming from the
external controller, the clock will be applied to the card
under the control of the microcontroller or similar device
after the activation sequence has been completed.
DATA I/O, AUX1 and AUX2 LEVEL SHIFTERS
The three bidirectional level shifters I/O, AUX1 and
AUX2 adapt the voltage difference that might exist between
the microcontroller and the smart card. These three
channels are identical. The first side of the bidirectional
level shifter dropping Low (falling edge) becomes the driver
side until the level shifter enters again in the idle state pulling
High CRD_IO and I/Ouc.
Passive 11 kW pullup resistors have been internally
integrated on each terminal of the bidirectional channel. In
addition with these pullup resistors, an active pullup
circuit provides a fast charge of the stray capacitance.
The current to and from the card I/O lines is limited
internally to 15 mA and the maximum frequency on these
lines is 1 MHz.
STANDBY MODE
After a Poweron reset, the circuit enters the standby
mode. A minimum number of circuits are active while
waiting for the microcontroller to start a session:
All card contacts are inactive
Pins I/Ouc, AUX1uc and AUX2uc are in the
highimpedance state (11 kW pullup resistor to V
DD
)
Card pins are inactive and pulled Low
Supply Voltage monitoring is active
The internal DC/DC converter oscillator is running.
POWERUP
In the standby mode the microcontroller can check the
presence of a card using the signals INT and CMDVCC as
shown in Table 2:
Table 2. Card Presence State
INT CMDVCC State
HIGH HIGH Card present
LOW HIGH Card not present
If a card is detected present (CRD_PRES or CRD_PRES
active) the controller can start a card session by pulling
CMDVCC Low. Card activation is run (t0, Figure 5). This
PowerUp Sequence makes sure all the card related signals
are LOW during the CRD_V
CC
positive going slope. These
lines are validated when CRD_V
CC
is stable and above the
minimum voltage specified. When the CRD_V
CC
voltage
reaches the programmed value (3.0 V or 5.0 V), the circuit
activates the card signals according to the following
sequence (Figure 5):
CRD_V
CC
is poweredup at its nominal value (t1)
I/O, AUX1 and AUX2 lines are activated (t2)
Then Clock channel is activated and the clock signal is
applied to the card (t3)
Finally the Reset level shifter is enabled (t4)
NCN8024
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12
The clock can also be applied to the card using a RSTIN
mode allowing controlling the clock starting by setting
RSTIN Low (Figure 4). Before running the activation
sequence, that is before setting Low CMDVCC RSTIN is set
High. In these initial conditions CRD_CLK starts when
RSTIN is pulled Low. This allows a precise count of clock
pulses before toggling CRD_RST High for ATR
(Answer To Reset) request.
The internal activation sequence activates the different
channels according to a specific hardware builtit sequencing
internally defined but at the end the actual activation
sequencing is the responsibility of the application software
and can be redefined by the microcontroller to comply with
the different standards and the different ways the standards
manage this activation (for example light differences exist
between the EMV and the ISO7816 standards).
Figure 4. Activation Sequence RSTIN mode (RSTIN Starting High)
CRD_RST
CRD_VCC
CRD_IO
CRD_CLK
CMDVCC
ATR
RSTIN
t0 t1 t2
Figure 5. Activation Sequence Normal Mode
CRD_RST
CRD_VCC
CRD_IO
CRD_CLK
CMDVCC
ATR
RSTIN
t0 t1 t2 t3
t
act
t4

NCN8024DTBR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Interface - Specialized SMART CARD IC 3ST 8INPUT
Lifecycle:
New from this manufacturer.
Delivery:
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