NCN8024
http://onsemi.com
13
POWERDOWN
When the communication session is completed the
NCN8024 runs a deactivation sequence by setting High
CMDVCC. The below power down sequence is executed:
CRD_RST is forced to Low
CRD_CLK is set Low 12 ms after CRD_RST.
CRD_IO, CRD_AUX1 and CRD_AUX2 are pulled Low
Finally CRD_V
CC
supply can be shutoff.
Figure 6. Deactivation Sequence
CRD_RST
CRD_IO
CRD_CLK
CMDVCC
CRD_VCC
t
deact
FAULT DETECTION
In order to protect both the interface and the external smart
card, the NCN8024 provides security features to prevent
failures or damages as depicted here after.
Card extraction detection
V
DD
under voltage detection
Shortcircuit or overload on CRD_V
CC
Card pin current limitation: in the case of a short circuit
to ground. No feedback is provided to the external MPU.
DC/DC operation: the internal circuit continuously
senses the CRD_V
CC
voltage (in the case of either over
or under voltage situation).
DC/DC operation: undervoltage detection on V
DDP
or
overload on VUP
Overheating
Figure 7. Fault Detection and Interrupt Management
Debounce Debounce
Powerdown Caused by
ShortCircuit
Powerdown Resulting of
Card Extraction
INT
CRD_VCC
CRD_PRES
CMDVCC
Interrupt Pin Management:
A card session is opened by toggling CMDVCC High to
Low.
Before a card session, CMDVCC is supposed to be in a
High position. INT is Low if no card is present in the card
connector (Normally open or normally closed type). INT is
High if a card is present. If a card is inserted (INT = High)
and if V
DD
drops below the UVLO threshold then INT pin
drops Low immediately. It turns back High when V
DD
increases again over the UVLO limit (including hysteresis),
a card being still present.
During a card session, CMDVCC is Low and INT pin
goes Low when a fault is detected. In that case a deactivation
is immediately and automatically performed (see Figure 6).
When the microcontroller resets CMDVCC to High it can
sense the INT level again after having got completed the
deactivation.
As illustrated by Figure 7 the device has a debounce timer
of 8 ms typical duration. When a card is inserted, output INT
goes High only at the end of the debounce time. When the
card is removed a deactivation sequence is automatically
and immediately performed and INT goes Low.
NCN8024
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14
ESD PROTECTION
The NCN8024 includes devices to protect the pins against
the ESD spikes voltages. To cope with the different ESD
voltages developed across these pins, the built in structures
have been designed to handle either 2 kV, when related to the
micro controller side, or 8 kV when connected with the
external contacts (HBM model). Practically, the CRD_RST,
CRD_CLK, CRD_IO, CRD_AUX1, CRD_AUX2,
CRD_PRES and CRD_PRES pins can sustain 8 kV. The
CRD_VCC pin has the same ESD protection and can source
up to 75 mA continuously, the absolute maximum current
being internally limited with a max at 150 mA. The
CRD_VCC current limit depends on V
DDP
and CRD_VCC.
Figure 8. Application Schematic
CLKDIV1
CLKDIV2
GNDP
C2
VDDP
C1
VUP
CRD_PRES
CRD_I/O
CRD_AUX2
CRD_GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
CLKIN
NC
AUX2uc
VDD
I/Ouc
AUX1uc
GND
CRD_CLK
CRD_VCC
CRD_RST
PORADJ
RSTIN
NCN8024
3.3 V Microcontroller
Vcc
RST
CLK
C4
GND
Vpp
I/O
C8
1
2
3
4
5
6
7
8
SMART CARD
R1
R2
VDD
+3.3V
DET
Normally Open
100 nF
VDD
+3.3V
100 nF
330 nF
VDDP
100 nF
+
100 nF
220 nF
XTAL1 XTAL2
Optional R1/R2 resistor divider
connected to Ground
10 mF
5V/3V
100 kW
CRD_AUX1
CRD_PRES
+3.3V
+5V or
if not used PORADJ has to be
INT
CMDVCC
ORDERING INFORMATION
Device Package Shipping
NCN8024DWR2G SOIC28
(PbFree)
1000 / Tape & Reel
NCN8024DTBR2G* TSSOP28
(PbFree)
2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Consult Sales Office
NCN8024
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15
PACKAGE DIMENSIONS
SOIC28 WB
CASE 751F05
ISSUE H
11.00
28X
0.52
28X
1.30
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
28
14 15
8X
A1
1
15
14
28
B
S
X
M
0.025 Y
S
T
M
0.25 Y
M
SEATING
PLANE
A
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.13 0.29
B 0.35 0.49
C 0.23 0.32
D 17.80 18.05
E 7.40 7.60
G 1.27 BSC
H 10.05 10.55
L 0.41 0.90
M 0 8
__
L
C
PIN 1 IDENT
D
E
H
0.10
X
Y
G
T
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBER
PR5OTRUSION SHALL NOT BE 0.13 TOTATL IN
EXCESS OF B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*

NCN8024DTBR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Interface - Specialized SMART CARD IC 3ST 8INPUT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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