1. General description
The HITAG product line is well known and established in the contactless identification
market.
Due to the open marketing strategy of NXP Semiconductors there are various
manufacturers well established for both the transponders / cards as well as the
Read/Write Devices. All of them supporting HITAG 1 and HITAG 2 transponder IC's. With
the new HITAG S family, this existing infrastructure is extended with the next generation of
IC’s being substantially smaller in mechanical size, lower in cost, offering more operation
distance and speed, but still being operated with the same reader infrastructure and
transponder manufacturing equipment.
One Protocol - two memory options.
The protocol and command structure for HITAG S is based on HITAG 1, including
anticollision algorithm.
Two different memory sizes are offered and can be operated using exactly the same
protocol.
HITAG S256 with 256 bit Total Memory Read/Write
HITAG S2048 with 2048 bit Total Memory Read/Write
2. Features and benefits
2.1 Features
Integrated Circuit for Contactless Identification Transponders and Cards
Integrated resonance capacitor of 210 pF with 5 % tolerance over full production
Frequency range 100 kHz to 150 kHz.
2.2 Protocol
Modulation Read/Write Device Transponder: 100 % ASK and Binary Pulse Length
Coding
Modulation Transponder Read/Write Device: Strong ASK modulation with
Anticollision, Manchester and Bi-phase Coding
Fast Anticollision Protocol for inventory tracking: 100 Tags in 3.2 seconds
Cyclic Redundancy Check (CRC)
Optional Transponder Talks First Modes with user defined data length
Temporary switch from Transponder Talks First into Reader Talks First Mode
HTSICH56; HTSICH48
HITAG S transponder IC
Rev. 3.1 — 11 December 2014
210331
Product short data sheet
COMPANY PUBLIC
HTSICH56_48_SDS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 11 December 2014
210331 2 of 21
NXP Semiconductors
HTSICH56; HTSICH48
HITAG S transponder IC
Data Rate Read/Write Device to Transponder: 5.2 kBit/s
Data Rates Transponder to Read/Write Device: 2 kBit/s, 4 kBit/s, 8 kBit/s
2.3 Memory
Two memory options (256 bit, 2048 bit)
Up to 100000 erase/write cycles
10 years non-volatile data retention
Secure Memory Lock functionality
2.4 Supported standards
Full compliant to ISO 11784/85 Animal ID
Targeted to operated on hardware infrastructure of new upcoming standards
ISO 14223 (Animal ID with anticollision and read/write functionality)
ISO 18000-2 (AIDC Techniques-RFID or Item Management)
Supports German Waste Management Standard and Pigeon Race Standard
2.5 Security features
32 bit Unique Identification Number (UID)
48 bit secret key based encrypted authentication
2.6 Delivery types
Sawn, gold - bumped 8” Wafer
Sawn, gold - megabumped 8” Wafer
Contactless Chip Card Module MOA4
HVSON2
3. Applications
Animal Identification
Laundry Automation
Beer keg and gas cylinder logistic
Pigeon Race Sports
Brand Protection Applications
HTSICH56_48_SDS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 11 December 2014
210331 3 of 21
NXP Semiconductors
HTSICH56; HTSICH48
HITAG S transponder IC
4. Quick reference data
[1] Typical ratings are not guaranteed. Values are at 25 C.
[2] Measured with Q
coil
= 20, L
coil
= 7.5 mH, optimal tuned to resonance circuit; V
IN1-IN2
= 2 V (RMS)
5. Ordering information
[1] This package is also known as MOA4
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ
[1]
Max Unit
Wafer EEPROM characteristics
t
ret
retention time T
amb
55 C 10 - - year
N
endu(W)
write endurance 100000 cycle
Interface characteristics
C
i
input capacitance between IN1 and IN2
HTSICxxxxxEW/x7
[2]
199 210 221 pF
Table 2. Ordering information
Type number Package
Name Memory size Description Version
HTSICH5601EW/V7 Wafer 256 bit Au-bumped die on sawn wafer, inkless -
HTSICH4801EW/V7 Wafer 2048 bit Au-bumped die on sawn wafer, inkless -
HTSICC5601EW/C7 Wafer 256 bit Au-megabumped die on sawn wafer,
inkless
-
HTSICC4801EW/C7 Wafer 2048 bit Au-megabumped die on sawn wafer,
inkless
-
HTSMOH5602EV PLLMC
[1]
256 bit plastic leadless module carrier
package; 35 mm wide tape
SOT500-2
HTSMOH4802EV PLLMC
[1]
2048 bit plastic leadless module carrier
package; 35 mm wide tape
SOT500-2
HTSH5601ETK HVSON2 256 bit plastic thermal enhanced very thin
small outline package; no leads;
2 terminals; body 3 2 0.85 mm
SOT899-1
HTSH4801ETK HVSON2 2048 bit plastic thermal enhanced very thin
small outline package; no leads;
2 terminals; body 3 2 0.85 mm
SOT899-1

HTSICC4801EW/C7,00

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders HTSICC4801EW UNCASED/FOIL//C7
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union