ADG1406/ADG1407 Data Sheet
Rev. C | Page 20 of 20
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AE
28
15
14
1
8 °
0 °
SEATING
PLANE
COPLANARITY
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
Figure 38. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 39. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 0.75 mm Package Height
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Description Package Option
ADG1406BRUZ −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1406BRUZ-REEL7 −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1406BCPZ-REEL7 −40°C to +125°C 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-7
ADG1407BRUZ −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1407BRUZ-REEL7 −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1407BCPZ-REEL7 −40°C to +125°C 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-7
1
Z = RoHS Compliant Part.
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D07419-0-6/16(C)
