VN5160S-E Package and PCB thermal data
Doc ID 13493 Rev 5 25/31
Figure 33. SO-8 Thermal impedance junction ambient single pulse
Equation 1: pulse calculation formula
where = t
P
/T
Figure 34. Thermal fitting model of a single-channel HSD in SO-8
(1)
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZT H (°C/W)
Footprint
2 cm
2
Z
TH
R
TH
Z
THtp
1 +=
Package and PCB thermal data VN5160S-E
26/31 Doc ID 13493 Rev 5
Table 16. Thermal parameter
Area/island (cm
2
)Footprint2
R1 (°C/W) 1.2
R2 (°C/W) 6
R3 (°C/W) 3.5
R4 (°C/W) 21
R5 (°C/W) 16
R6 (°C/W) 58 28
C1 (W.s/°C) 0.0008
C2 (W.s/°C) 0.0016
C3 (W.s/°C) 0.0075
C4 (W.s/°C) 0.045
C5 (W.s/°C) 0.35
C6 (W.s/°C) 1.05 2
VN5160S-E Package and packing information
Doc ID 13493 Rev 5 27/31
5 Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
5.2 Package mechanical data
Figure 35. SO-8 package dimensions

VN5160S-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Sngl Ch HiSide Drivr
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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