4
I
F2
6
5
GND
3
4
V
O2
V
F2
I
O2
+
I
F1
8
7
V
CC
1
2
V
O1
I
CC
V
F1
I
O1
+
SHIELD
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 8)
Schematic
HCPL-4701 and HCPL-070A HCPL-4731 and HCPL-073A
I
F
8
V
CC
2
3
I
CC
V
F
ANODE
CATHODE
+
V
B
I
B
6
5
GND
V
O
I
O
7
SHIELD
5
Package Outline Drawings
8-Pin DIP Package (HCPL-4701, HCPL-4731)
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4701, HCPL-4731)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
1.080 ± 0.320
(0.043 ± 0.013)
2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
5° TYP.
OPTION CODE*
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
TYPE NUMBER
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 ± 0.320
(0.043 ± 0.013)
3.56 ± 0.13
(0.140 ± 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
6
Small-Outline SO-8 Package (HCPL-070A, HCPL-073A)
XXX
YWW
8765
4321
5.994 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.406 ± 0.076
(0.016 ± 0.003)
1.270
(0.050)
BSC
* 5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
45° X
0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)
MIN.
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
PIN ONE
Solder Reflow Thermal Profile
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
Figure 1a. Solder Reflow Thermal Profile.
Note: Non-halide flux should be used.

HCPL-4731#300

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
High Speed Optocouplers 2Ch 10mA 600mW
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union