9397 750 14955 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 28 July 2005 4 of 22
Philips Semiconductors
BF1207
Dual N-channel dual gate MOSFET
6. Thermal characteristics
7. Static characteristics
Fig 1. Power derating curve
T
sp
(°C)
0 20015050 100
001aac741
100
150
50
200
250
P
tot
(mW)
0
Table 6: Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-sp)
thermal resistance from junction
to soldering point
240 K/W
Table 7: Static characteristics
T
j
=25
°
C.
Symbol Parameter Conditions Min Typ Max Unit
Per MOSFET; unless otherwise specified
V
(BR)DSS
drain-source breakdown voltage V
G1-S
=V
G2-S
=0V; I
D
=10µA
amplifier A 6 - - V
amplifier B 6 - - V
V
(BR)G1-SS
gate1-source breakdown voltage V
GS
=V
DS
=0V; I
G1-S
=10mA 6 - 10 V
V
(BR)G2-SS
gate2-source breakdown voltage V
GS
=V
DS
=0V; I
G2-S
=10mA 6 - 10 V
V
F(S-G1)
forward source-gate1 voltage V
G2-S
=V
DS
=0V; I
S-G1
= 10 mA 0.5 - 1.5 V
V
F(S-G2)
forward source-gate2 voltage V
G1-S
=V
DS
=0V; I
S-G2
= 10 mA 0.5 - 1.5 V
V
G1-S(th)
gate1-source threshold voltage V
DS
=5V; V
G2-S
=4V; I
D
= 100 µA 0.3 - 1.0 V
V
G2-S(th)
gate2-source threshold voltage V
DS
=5V; V
G1-S
=5V; I
D
= 100 µA 0.4 - 1.0 V
I
DSX
drain-source current V
G2-S
=4V; V
DS
=5V; R
G1
=68kΩ
amplifier A
[1]
13 - 23 mA
amplifier B
[2]
9 - 19 mA