CS61884
70 DS485F3
21. LFBGA PACKAGE DIMENSIONS
CS61884
DS485F3 71
22. LQFP PACKAGE DIMENSIONS
INCHES MILLIMETERS
DIM MIN NOM MAX MIN NOM MAX
A --- 0.55 0.063 --- 1.40 1.60
A1 0.002 0.004 0.006 0.05 0.10 0.15
B 0.007 0.008 0.011 0.17 0.20 0.27
D 0.854 0.866 BSC 0.878 21.70 22.0 BSC 22.30
D1 0.783 0.787 BSC 0.791 19.90 20.0 BSC 20.10
E 0.854 0.866 BSC 0.878 21.70 22.0 BSC 22.30
E1 0.783 0.787 BSC 0.791 19.90 20.0 BSC 20.10
e* 0.016 0.020 0.024 0.40 0.50 BSC 0.60
0.000° 7.000° 0.00° 7.00°
L 0.018 0.024 0.030 0.45 0.60 0.75
* Nominal pin pitch is 0.50 mm
Controlling dimension is mm.
JEDEC Designation: MS022
144L LQFP PACKAGE DRAWING
E1
E
D1
D
1
e
L
B
A1
A
CS61884
72 DS485F3
23. ORDERING INFORMATION
24. ENVIRONMENTAL, MANUFACTURING, & HANDLING INFORMATION
* MSL (Moisture Sensitivity Level) as specified by IPC/JEDEC J-STD-020.
All devices are now lead (Pb) free.
25. REVISION HISTORY
Model Temperature Package
CS61884-IQZ
-40 to +85 °C
160-pin LFBGA, 15mm X 15mm
CS61884-IRZ 144-pin LQFP, 15mm X 15mm
Model Number Peak Reflow Temp MSL Rating* Max Floor Life
CS61884-IQZ
260 °C 3 7 Days
CS61884-IRZ
Revision Date Changes
F3 MAR 2011
Removed all lead-containing device ordering information. Removed 160-pin
FBGA package option. Corrected formerly named TFBGA to LFBGA.

CS61884-IQZR

Mfr. #:
Manufacturer:
Cirrus Logic
Description:
Telecom Interface ICs IC Octal T1/E1/J1 Line Interface Unit
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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