7．Precautions
①
Storage conditions
Please follow the conditions below.
・Before opened: Temperature 5 ～ 30 ℃, Relative humidity less than 60 %.
(Before opened LED should be used within a year)
・After opened: Temperature 5 ～ 30 ℃, Relative humidity less than 60 %.
(Please apply soldering within 1 week)
・After opened LED should be kept in an aluminum moisture proof bag with a moisture
absorbent material (silica gel).
・Avoid exposing to air with corrosive gas.
If exposed, electrode surface would be damaged, which may affect soldering.
②
Usage conditions
This product is not designed for the use under any of the following conditions.
Please carefully check the performance and reliability well enough in case of using under any of the
following conditions;
・In a place with a lot of moisture, dew condensation, briny air, and corrosive gas.
(Cl, H2S, NH3, SO2, NOX, etc.)
・Under the direct sunlight, outdoor exposure, and in a dusty place.
・In water, oil, medical fluid, and organic solvent.
Please do not use component parts like rubber which may contain sulfur (gasket packing, adhesive material,
etc.).
Please note that any strong acidic or alcoholic elements could effect the silicon resin used in the LED device.
The heat and light released from the LED device, could generate halogen gas from the surrounding materials,
which may have adverse impact on the module. Before using please consider carefully about this issue.
③
Heat radiation and Installation
If forward current (IF) is applied to single-state module at any current, there is a risk of damaging LED
or emitting smoke, due to increase in temperature.
Equip with specified heat radiator(heat sink), and avoid heat being stuffed inside the module.
Material of substrate is alumina ceramic. If installed inappropriately, trouble of insufficient heat radiation may
occur , which may result in board cracks or lighting defects due to overheat. Please take particular notice for
installation.
Refer to the following cautions while installing the LED device on heat sink.
・Apply thermolysis adhesive, adhesive sheet or peculiar connector when mounted on heat radiator.
In case of applying adhesive or adhesive sheet only, check the effectiveness and reliability before fixing.
If LED comes off from heat radiator, unusual temperature rise entails hazardous phenomena including
device deterioration, coming off of solder at leads, and emitting smoke, along with LED device deffects.
・When LED device is mechanically fixed or locked, Please take into consideration regarding the method of
attachment due to fail from stress.
・Please apply appropriate stress and design carefully, when fixing the LED device using holder. Any
excessive or uneven stress could break LED deviceʼs substrate.
・Avoid convexly uneven boards.
Convex board is subject to substrate cracking or debasement of heat release.
・It is recommended to apply adhesive or adhesive sheet with high thermal conductivity
for radiation of heat effectively.
・Please take care about the influence of color change of adhesive or adhesive sheet in initial and long term
period, which may affect light output or color due to change of reflectance from backside.
sharp LDE-E15-4-16-B
Model No. GW6B*G**HD6
13
“Contents in this technical document be changed without any notice due to the product modification.”
http://www.sharp-world.com/products/device/
