・The outer edges of the substrate may be uneven in some cases. Please avoid choosing these areas as fixing
points, while designing for installation.
・In case of using heat radiation sheet or heat radiation adhesive, light reflection or absorption of these
materials may influence the output of LED device. Especially, the color change that occur due to l
ong-term use has direct impact on output of LED devices, and hence careful consideration is required
while choosing the radiation sheet ro adhesive.
・Please avoid using any materials(such as PBT resin) that may release corrosive gases, around LED device.
④
Connecting method
Use soldering for conncetions. Follow the conditions mentioned below, to preserve the connection strength.
・Use soldering iron with thermo controller (tip temperature 380 ℃), within 5 seconds per one place.
・Secure the solderwettability on whole solder pad and leads.
・During the soldering process, put the ceramic board on materials whose conductivity is poor enough
not to radiate heat of soldering.
・Warm up (with using a heated plate) the substrate is recommended before soldering.
( preheat condition: 100 ℃ ～ 150 ℃, within 60 sec )
・Avoid touching any part of resin with soldering iron.
・This product is not designed for reflow and flow soldering.
・Avoid such lead arrangement as applying stress to solder-applied area.
・Please do not detach solder and make re-solder.
・Please solder evenly on each electrode.
・Please prevent flux from touching to resin.
・Do the soldering on stable stand. Avoid soldering on moving or vibrating objects.
・Please avoid touching the soldering unit to resin.
⑤
Static electricity
This product is subject to static electricity, so take measures like wearing wrist band to cope with it.
Install circuit protection device to drive circuit, if necessary.
・Any excessive or uneven stress on the ceramic substrate could break the substrate. Please design such that,
proper/uniform stress is applied on the substrate, when fixing the LED device using a holder.
・When fixing the LED device with a holder, please take note if any excessive or uneven stress is applied
when pressing the substrate with holder. Due to this, the gap may arise between LED device and
adhesive material, which may affect the heat dissipation of the device.
・Do not touch resin part including white resin part on the surface of LED.
No light emission may occur due to damage of resin or cutting wire of LEDs by outer force.
When using tweezers, please handle by ceramic substrate part and avoid touching resin part.
For mounting, please handle by side part of ceramic or the specified area shown below.
(0.5)
(6.0)
(4.0)
Handring area
sharp LDE-E15-4-16-B
Model No. GW6B*G**HD6
14
“Contents in this technical document be changed without any notice due to the product modification.”
http://www.sharp-world.com/products/device/
