3-3.Derating curve
0
100
200
300
400
500
-30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110
Forward Current Derating Curve
Case Temperature Tc[℃]
Forward Current I
[mA]
F
(Note) To keep the case temperature lower than the rating, enough heat-radiation performance needs to
be secured by using an adequate heat sink (refer to section 7-③).
For soldering connection, please evaluate in your usage environment to make sure soldering reliability.
( Above derating curve is specified to LED device, not for soldering connection )
And please consider to avoid physical stress between wire and substrate,
and some protection like silicon bond on top of soldered wire is recommended.
Please ensure the maintenance of heat radiation does not exceed case temperature over the rating
in operation.
（Measuring point for case temperature）
Thermal Resistance: 3.4 ℃/W(Typical value)
measuring point
Please take note of the following, when measuring case temperature.
1 The LED device mounting surface should be flat/plain surface.
2 The substrate surface temperature should be uniform.
sharp LDE-E15-4-16-B
Model No. GW6B*G**HD6
5
“Contents in this technical document be changed without any notice due to the product modification.”
http://www.sharp-world.com/products/device/
