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TDA8595J/N2S,112
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
P49-P51
TDA8595
All informatio
n provided in thi
s document is
subject to le
gal disclaimers.
© NXP B.V
.
2013. All rights rese
rved.
Product data sheet
Rev
. 5 — 1
1 June 2013
43 of 51
NXP Semiconductors
TDA8595
I
2
C-bus controlle
d 4
45 W power amplifier
14. T
est
information
14.1
Quality i
nformation
This product has been qualified in accordance
with the Automotive Electronics Council
(AEC) standard
Q100 - Failure mechanism b
ased stress
te
st qualification for integrated
circuits
, and is suitable for use in automotive applic
ations.
Fig 36.
PCB layout of test and applicat
ion circuit for
TDA8595J or T
DA8595SD;
components top
Fig 37.
PCB layout of test and applicat
ion circuit for
TDA8595J or T
DA8595SD;
components bottom (top view)
001aad164
top
+
+
+
++
TDA8594/TDA8595
Sense
2200
μ
F
2.2
μ
F
2.2
μ
F
1
μ
F
10
μ
F
Philips Semiconductors
SCL
GND
+ 5V
SDA
12C
supply
470 nF
470 nF
−
4 +
−
3 +
OUT
on
Mute
off
GND
12C
D1
Legacy
GND
V
P
V
P
10 k
Ω
clip 2
DE (11)
DA (01)
D8 (00)
DZ 8.2 V
+ 1
−
+ 2
−
OUT
SGND
IN
34
2
1
mode on
diag s. by
address
select
001aad165
bot
TDA3664
4
×
470 nF
470 nF
470 nF
4.7 k
Ω
18 k
Ω
10 k
Ω
10 k
Ω
2 k
Ω
BC859
12 k
Ω
51 k
Ω
22 k
Ω
220 nF
220 nF
250
Ω
TDA8595
All informatio
n provided in thi
s document is
subject to le
gal disclaimers.
© NXP B.V
.
2013. All rights rese
rved.
Product data sheet
Rev
. 5 — 1
1 June 2013
44 of 51
NXP Semiconductors
TDA8595
I
2
C-bus controlle
d 4
45 W power amplifier
15. Package
outline
Fig 38.
Package outline SOT827
-1 (DBS27P)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT827-1
sot827-1_po
13-02-13
13-05-30
Unit
mm
max
nom
min
19
4.6
4.4
0.5
0.3
29.2
28.8
24.8
24.4
15.9
15.5
3.55
3.25
12
21
8
1.15
0.85
22.9
22.1
2.1
1.8
A
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DBS27P: plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm)
SOT827-1
A
2
b
p
0.60
0.45
cD
(1)
dD
h
0.6
0.25
Qvw
0.03
1.8
1.2
xZ
(1)
E
(1)
ee
1
e
2
4
E
h
jL
3.40
6.8
L
2
3.9
3.1
L
3
L
4
4
m
0
10
20 mm
scale
x
e
2
e
1
e
m
B
w
v
L
E
A
A
2
L
3
L
4
L
2
D
h
E
h
non-concave
view B: mounting base side
D
b
p
d
Z
1
27
j
c
Q
TDA8595
All informatio
n provided in thi
s document is
subject to le
gal disclaimers.
© NXP B.V
.
2013. All rights rese
rved.
Product data sheet
Rev
. 5 — 1
1 June 2013
45 of 51
NXP Semiconductors
TDA8595
I
2
C-bus controlle
d 4
45 W power amplifier
Fig 39.
Package outline SOT851
-2 (HSOP36)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT851-2
SOT851-2
04-05-04
HSOP36: plastic, heatsink small outline package; 36 leads; low stand-off height
b
p
z
11
8
36
19
D
1
D
2
E
1
E
A
H
E
D
E
2
y
x
e
w
M
pin 1 index
vA
M
X
θ
L
p
detail X
(A
3
)
A
2
A
4
c
A
Q
0
5
10 mm
scale
UNIT
A
4
(1)
mm
+
0.08
−
0.04
3.5
0.35
DIMENSIONS (mm are the original dimensions)
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
A
2
3.5
3.2
D
2
1.1
0.9
H
E
14.5
13.9
L
p
1.1
0.8
Q
1.7
1.5
2.55
2.20
v
0.25
w
0.12
yZ
8
°
0
°
θ
0.07
x
0.03
D
1
13.0
12.6
E
1
6.2
5.8
E
2
2.9
2.5
b
p
c
0.32
0.23
e
0.65
D
(2)
16.0
15.8
E
(2)
11.1
10.9
0.38
0.25
A
3
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
P49-P51
TDA8595J/N2S,112
Mfr. #:
Buy TDA8595J/N2S,112
Manufacturer:
NXP Semiconductors
Description:
Audio Amplifiers I2C-BUS CONTROLLED 4X45 W POWER AMP
Lifecycle:
New from this manufacturer.
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