TDA8595 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 11 June 2013 43 of 51
NXP Semiconductors
TDA8595
I
2
C-bus controlled 4 45 W power amplifier
14. Test information
14.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated
circuits, and is suitable for use in automotive applications.
Fig 36. PCB layout of test and application circuit for TDA8595J or TDA8595SD;
components top
Fig 37. PCB layout of test and application circuit for TDA8595J or TDA8595SD;
components bottom (top view)
001aad164
top
+
+
+
++
TDA8594/TDA8595
Sense
2200 μF
2.2 μF
2.2 μF
1 μF
10 μF
Philips Semiconductors
SCL
GND
+ 5V
SDA
12C
supply
470 nF 470 nF
4 + 3 +
OUT
on
Mute
off
GND
12C
D1
Legacy
GND V
P
V
P
10 kΩ
clip 2
DE (11)
DA (01)
D8 (00)
DZ 8.2 V
+ 1 + 2
OUT
SGND
IN
34 21
mode on
diag s. by
address
select
001aad165
bot
TDA3664
4 × 470 nF
470 nF470 nF
4.7 kΩ
18 kΩ
10 kΩ
10 kΩ
2 kΩ
BC859
12 kΩ 51 kΩ
22 kΩ
220 nF 220 nF
250
Ω
TDA8595 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 11 June 2013 44 of 51
NXP Semiconductors
TDA8595
I
2
C-bus controlled 4 45 W power amplifier
15. Package outline
Fig 38. Package outline SOT827-1 (DBS27P)
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT827-1
sot827-1_po
13-02-13
13-05-30
Unit
mm
max
nom
min
19
4.6
4.4
0.5
0.3
29.2
28.8
24.8
24.4
15.9
15.5
3.55
3.25
12
21 8
1.15
0.85
22.9
22.1
2.1
1.8
A
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DBS27P: plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm) SOT827-1
A
2
b
p
0.60
0.45
cD
(1)
dD
h
0.6
0.25
Qvw
0.03
1.8
1.2
xZ
(1)
E
(1)
ee
1
e
2
4
E
h
jL
3.40 6.8
L
2
3.9
3.1
L
3
L
4
4
m
0 10 20 mm
scale
x
e
2
e
1
e
m
B
w
v
L
E
A
A
2
L
3
L
4
L
2
D
h
E
h
non-concave
view B: mounting base side
D
b
p
d
Z
1 27
j
c
Q
TDA8595 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 11 June 2013 45 of 51
NXP Semiconductors
TDA8595
I
2
C-bus controlled 4 45 W power amplifier
Fig 39. Package outline SOT851-2 (HSOP36)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT851-2
SOT851-2
04-05-04
HSOP36: plastic, heatsink small outline package; 36 leads; low stand-off height
b
p
z
118
36 19
D
1
D
2
E
1
E A
H
E
D
E
2
y
x
e
w
M
pin 1 index
vA
M
X
θ
L
p
detail X
(A
3
)
A
2
A
4
c
A
Q
0 5 10 mm
scale
UNIT
A
4
(1)
mm
+0.08
0.04
3.5 0.35
DIMENSIONS (mm are the original dimensions)
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
A
2
3.5
3.2
D
2
1.1
0.9
H
E
14.5
13.9
L
p
1.1
0.8
Q
1.7
1.5
2.55
2.20
v
0.25
w
0.12
yZ
8°
0°
θ
0.07
x
0.03
D
1
13.0
12.6
E
1
6.2
5.8
E
2
2.9
2.5
b
p
c
0.32
0.23
e
0.65
D
(2)
16.0
15.8
E
(2)
11.1
10.9
0.38
0.25
A
3

TDA8595J/N2S,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Audio Amplifiers I2C-BUS CONTROLLED 4X45 W POWER AMP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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