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6048C–ATARM–29-Jun-06
AT91SAM7A1
25. Soldering Profile
Table 25-1 gives the recommended soldering profile from J-STD-20.
Small packages may be subject to higher temperatures if they are reflowed in boards with larger
components. In this case, small packages may have to withstand temperatures of up to 235° C,
not 220°C (IR reflow).
Recommended package reflow conditions depend on package thickness and volume. See
Table 25-2.
Notes: 1. The packages are qualified by Atmel by using IR reflow conditions, not convection or VPR.
2. By default, the package level 1 is qualified at 220°C (unless 235°C is stipulated).
3. The body temperature is the most important parameter but other profile parameters such as
total exposure time to hot temperature or heating rate may also influence component reliability.
A maximum of three reflow passes is allowed per component.
Table 25-1. Soldering Profile
Convection or
IR/Convection VPR
Average Ramp-up Rate (183° C to Peak) 3°C/sec. max. 10°C/sec.
Preheat Temperature 125°C ±25°C 120 sec. max
Temperature Maintained Above 183°C 60 sec. to 150 sec.
Time within 5°C of Actual Peak
Temperature
10 sec. to 20 sec. 60 sec.
Peak Temperature Range
220 +5/-0° C or
235 +5/-0° C
215 to 219°C or
235 +5/-0°C
Ramp-down Rate 6°C/sec. 10°C/sec.
Time 25°C to Peak Temperature 6 min. max
Table 25-2. Recommended Package Reflow Conditions
(1, 2, 3)
Parameter Temperature
Convection 220 +5/-0°C
VPR 215 to 219° C
IR/Convection 220 +5/-0°C
