16
Figure 5. Module drawing
DEVICE SHOWN WITH
DUST CAP AND
BAIL DELATCH
AFBR-57J5APZ
850nm LASER PROD
21CRF(J) CLASS1
CHINA 0445
SN: A30445CD1C
PPOG-4402-Din2
55.3 ± 0.2
8.5 ± 0.1
13.4 ± 0.1
6.25 ± 0.05
TX RX
1.91
13.6
12.4 ± 0.2
13.6
14.9 UNCOMPRESSED
0.55 UNCOMPRESSED
1.39 UNCOMPRESSED
AFBR-57J5APZ
850nm LASER PROD
21CRF(J) CLASS1
SINGAPORE 0446
SN: AJ0446CD1C
PPOC-4102-DIn2
+ 0.2
0
17
Figure 6. SFP host board mechanical layout
2x 1.7
20x 0.5 ± 0.03
0.9
2 ± 0.005 TYP.
0.06 L A S B S
10.53
11.93
20
10
11
PIN 1
20
10
11
PIN 1
0.8
TYP .
10.93
9.6
2x 1.55 ± 0.05
3.2
5
LEGEND
1. PADS AND VIAS ARE CHASSIS GROUND
2. THROUGH HOLES, PLATING OPTIONAL
3. HATCHED AREA DENOTES COMPONENT AND
TRACE KEEPOUT (EXCEPT CHASSIS GROUND)
4. AREA DENOTES COMPONENT
KEEPOUT (TRACES ALLOWED)
DIMENSIONS ARE IN MILLIMETERS
4
3
2
1
1
26.8
5
11x 2.0
10
3x
41.3
42.3
B
10x 1.05 ± 0.01
16.25
REF .
14.25
11.08
8.58
5.68
2.0
11x
11.93
9.6
4.8
8.48
A
3.68
SEE DETAIL 1
9x 0.95 ± 0.05
2.5
7.17.2
2.5
10
3x
34.5
16.25
MIN. PITCH
Y
X
DETAIL 1
0.85± 0.05
PCB
EDGE
0.06 L A S B S
0.1 S
0.1 L S
0.1 L S
0.1 Y
S B
L A
X A
S X
X A
Figure 7. SFP Assembly Drawing
41.78 ± 0.5
3.5 ± 0.3
1.7± 0.9
Tcase REFERENCE POINT
PCB
10 REF
(to PCB)
0.4± 0.1
(below PCB)
10.4 ± 0.1
15.25± 0.1
16.25± 0.1 MIN. PITCH
DIMENSIONS ARE IN MILLIMETERS
11.73 REF
CAGE ASSEMBLY
9.8 MAX.
15 MAX.
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Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-0671EN - January 29, 2013

AFBR-57J5APZ

Mfr. #:
Manufacturer:
Description:
Fiber Optic Transmitters, Receivers, Transceivers MM BTS SFP Ind-Temp RoHS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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