AFBR-57J5APZ Datasheet AFBR-57J5APZ | P4-P6

Flammability

The AFBR-57J5APZ optical transceiver is made of metal

and high strength, heat resistant, chemical resistant and

UL 94V-0 ame retardant plastic.

Predictive Failure Identication

The AFBR-57J5APZ predictive failure feature allows a host

to identify potential link problems before system perfor-

mance is impacted. Prior identication of link problems

enables a host to service an application via “fail over”

to a redundant link or replace a suspect device, main-

taining system uptime in the process. For applications

where ultra-high system uptime is required, a digital SFP

provides a means to monitor two real-time laser metrics

associated with observing laser degradation and pre-

dicting failure: average laser bias current (Tx_Bias) and

average laser optical power (Tx_Power).

Compliance Prediction:

Compliance prediction is the ability to determine if an

optical transceiver is operating within its operating and

environmental requirements. AFBR-57J5APZ devices

provide real-time access to transceiver internal supply

voltage and temperature, allowing a host to identify

potential component compliance issues. Received optical

power is also available to assess compliance of a cable

plant and remote transmitter. When operating out of re-

quirements, the link cannot guarantee error free trans-

mission.

Fault Isolation

The fault isolation feature allows a host to quickly

pinpoint the location of a link failure, minimizing

downtime. For optical links, the ability to identify a fault

at a local device, remote device or cable plant is crucial to

speeding service of an installation. AFBR-57J5APZ real-

time monitors of Tx_Bias, Tx_Power, Vcc, Temperature and

Rx_Power can be used to assess local transceiver current

operating conditions. In addition, status ags Tx_Disable

and Rx Loss of Signal (LOS) are mirrored in memory and

available via the two-wire serial interface.

Component Monitoring

Component evaluation is a more casual use of the

AFBR-57J5APZ real-time monitors of Tx_Bias, Tx_Power,

Vcc, Temperature and Rx_Power. Potential uses are as

debugging aids for system installation and design, and

transceiver parametric evaluation for factory or eld qual-

ication. For example, temperature per module can be

observed in high density applications to facilitate thermal

evaluation of blades, PCI cards and systems.

Table 1. Regulatory Compliance

Feature Test Method Performance

Electrostatic Discharge

(ESD) to the Electrical Pins

MIL-STD-883C Method 3015.4 Class 1 (> 2000 Volts)

Electrostatic Discharge

(ESD) to the Duplex LC

Receptacle

Variation of IEC 61000-4-2 Typically, no damage occurs with 25 kV

when the duplex LC connector receptacle is

contacted by a Human Body Model probe.

GR1089 10 contacts of 8 KV on the electrical faceplate

with device inserted into a panel.

Electrostatic Discharge

(ESD) to the Optical

Connector

Variation of IEC 801-2 Air discharge of 15kV(min) contact to

connector w/o damage

Electromagnetic

Interference (EMI)

FCC Class B

CENELEC EN55022 Class B

(CISPR 22A)

VCCI Class 1

System margins are dependent on customer

board and chassis design.

Immunity Variation of IEC 61000-4-3 Typically shows no measurable eect from a

10V/m eld swept from 10 MHz to 1 GHz.

Laser Eye Safety

and Equipment Type

Testing

US FDA CDRH AEL Class 1

US21 CFR, Subchapter J per Paragraphs 1002.10

and 1002.12.

(IEC) EN60825-1: 1994 + A11+A2

(IEC) EN60825-2: 1994 + A1

(IEC) EN60950: 1992 + A1 + A2 + A3+ A4 + A11

CDRH certication # 9720151-083

TUV le # 72060710

Component Recognition Underwriters Laboratories and Canadian Standards

Association Joint Component Recognition for

Information Technology Equipment Including

Electrical Business Equipment

UL File # E173874

BAUART

GEPRUFT

TYPE

APPROVED

TUV

Rheinland

Product Safety

Figure 2. Typical Application Conguration

Figure 3. Recommended Power Supply Filter

LASER DRIVER

MODULE DETECT

LOSS OF SIGNAL

SCL

SDA

Tx_FAULT

Tx_DISABLE

TD+

Tx FAULT

Tx DIS

TD–

RD+

RD–

MOD_DEF2

MOD_DEF1

MOD_DEF0

GND,R

4.7 k to

10 kΩ

50 Ω

4.7 k to 10 kΩ4.7 k to 10 kΩ

PROTOCOL IC

1 µH

10µF 0.1µF

0.1 µF

10µF 0.1µF

3.3 V

SERDES IC

Rx LOS

GND,T

0.01 µF

POST AMPLIFIER

100 Ω

4.7 k to 10 kΩ

100 Ω

6.8 kΩ

0.01 µF

4.7 k to 10 kΩ

1 µH

0.1 µF

SFP MODULE

10 µF

0.1 µF 10 µF

3.3 V

HOST BOARD

0.1 µF

NOTE: INDUCTORS MUST HAVE LESS THAN 1 Ω SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFP MODULE.

Table 2. Pin Description

Pin Name Function/Description Notes

1 VeeT Transmitter Ground

2 TX_FAULT Transmitter Fault Indication – High indicates a fault condition Note 1

3 TX_DISABLE Transmitter Disable – Module optical output disables on high or open Note 2

4 MOD-DEF2 Module Denition 2 – Two wire serial ID interface data line (SDA) Note 3

5 MOD-DEF1 Module Denition 1 – Two wire serial ID interface clock line (SCL) Note 3

6 MOD-DEF0 Module Denition 0 – Grounded in module (module present indicator) Note 3

7 no connect

8 RX_LOS Loss of Signal – High indicates loss of received optical signal Note 4

9 VeeR Receiver Ground

10 VeeR Receiver Ground

11 VeeR Receiver Ground

12 RD- Inverse Received Data Out Note 5

13 RD+ Received Data Out Note 5

14 VeeR Receiver Ground

15 VccR Receiver Power + 3.3 V Note 6

16 VccT Transmitter Power + 3.3 V Note 6

17 VeeT Transmitter Ground

18 TD+ Transmitter Data In Note 7

19 TD- Inverse Transmitter Data In Note 7

20 VeeT Transmitter Ground

Notes:

1. TX_FAULT is an open collector/drain output, which must be pulled up with a 4.7k – 10kΩ resistor on the host board. When high, this output

indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.

2. TX_DISABLE is an input that is used to shut down the transmitter optical output. It is internally pulled up (within the transceiver) with a 6.8kΩ

resistor.

Low (0 – 0.8V): Transmitter on

Between (0.8V and 2.0V): Undened

High (2.0 – Vcc max) or OPEN: Transmitter Disabled

3. The signals Mod-Def 0, 1, 2 designate the two wire serial interface pins. They must be pulled up with a 4.7k – 10kΩ resistor on the host board.

Mod-Def 0 is grounded by the module to indicate the module is present

Mod-Def 1 is serial clock line (SCL) of two wire serial interface

Mod-Def 2 is serial data line (SDA) of two wire serial interface

4. RX_LOS (Rx Loss of Signal) is an open collector/drain output that must be pulled up with a 4.7k – 10kΩ resistor on the host board. When high,

this output indicates the received optical power is below the worst case receiver sensitivity (as dened by the standard in use). Low indicates

normal operation. In the low state, the output will be pulled to < 0.8V.

5. RD-/+ designate the dierential receiver outputs. They are AC coupled 100Ω dierential lines which should be terminated with 100Ω dierential

at the host SERDES input. AC coupling is done inside the transceiver and is not required on the host board. The voltage swing on these lines will

be between 500 and 1600 mV dierential (250 – 800 mV single ended) when properly terminated.

6. VccR and VccT are the receiver and transmitter power supplies. They are dened at the SFP connector pin. The maximum supply current is 300

mA and the associated in-rush current will typically be no more than 30 mA above steady state after 500 nanoseconds.

7. TD-/+ designate the dierential transmitter inputs. They are AC coupled dierential lines with 100Ω dierential termination inside the module.

The AC coupling is done inside the module and is not required on the host board. The inputs will accept dierential swings of 400 – 2400 mV

(200 – 1200 mV single ended), though it is recommended that values between 500 and 1200 mV dierential (250 – 600 mV single ended) be

used for best EMI performance.

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18

AFBR-57J5APZ

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AFBR-57J5APZ