SSC7150
DS00001885A-page 10 2015 Microchip Technology Inc.
2.0 SYSTEM BLOCK DIAGRAM
The SSC7150 system block diagram is shown in Figure 2-1.
FIGURE 2-1: SSC7150 SYSTEM BLOCK DIAGRAM
SSC7150
Host Processor
3D
MAGNETOMETER
3D
GYROSCOPE
3D
ACCELEROMETER
I2C _ D A1/
I2C_CL1
I2C _ D A2/
I2C_CL2
9-AXIS SENSOR
FUSION INPUTS
VSENSOR _EN
I2C_ D 2_ WAKE #
I2 C2_W AKE
I2C 2_AL E RT#
Sensor
Power
I2C2_RESET#
2015 Microchip Technology Inc. DS00001885A-page 11
SSC7150
3.0 GUIDELINES FOR GETTING STARTED
3.1 Basic Connection Requirements
Getting started with the SSC7150 requires attention to a minimal set of device pin connections before proceeding with
development. The following is a list of pin names, which must always be connected:
All V
DD and VSS pins (see Section 3.2 “Decoupling Capacitors”)
All AV
DD and AVSS pins, even if the ADC module is not used (see Section 3.2 “Decoupling Capacitors”). Note
that there is no ADC support in this device. See Note below.
•V
CAP pin (see Section 3.3 “Capacitor on Internal Voltage Regulator (Vcap)”)
MCLR# pin (see Section 3.4 “Master Clear (MCLR#) Pin”)
Refer to the following schematic for connection information:
SSC7150 Sensor Hub Module, Assy. 6753, Schematic Revision 1.4.
3.2 Decoupling Capacitors
The use of decoupling capacitors on power supply pins, such as VDD, VSS, AVDD and AVSS is required. See Figure 3-1.
Consider the following criteria when using decoupling capacitors:
Value and type of capacitor: A value of 0.1 µF (100 nF), 10-20V is recommended. The capacitor should be a low
Equivalent Series Resistance (low-ESR) capacitor and have resonance frequency in the range of 20 MHz and
higher. It is further recommended that ceramic capacitors be used.
Placement on the printed circuit board: The decoupling capacitors should be placed as close to the pins as
possible. It is recommended that the capacitors be placed on the same side of the board as the device. If space is
constricted, the capacitor can be placed on another layer on the PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within one-quarter inch (6 mm) in length.
Handling high frequency noise: If the board is experiencing high frequency noise, upward of tens of MHz, add a
second ceramic-type capacitor in parallel to the above described decoupling capacitor. The value of the second
capacitor can be in the range of 0.01 µF to 0.001 µF. Place this second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as close to the
power and ground pins as possible. For example, 0.1 µF in parallel with 0.001 µF.
Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to
the decoupling capacitors first, and then to the device pins. This ensures that the decoupling capacitors are first in
the power chain. Equally important is to keep the trace length between the capacitor and the power pins to a min-
imum thereby reducing PCB track inductance.
Note: The AV
DD and AVSS pins must be connected, regardless of ADC use and the ADC voltage reference
source.
SSC7150
DS00001885A-page 12 2015 Microchip Technology Inc.
FIGURE 3-1: RECOMMENDED MINIMUM CONNECTION
3.2.1 BULK CAPACITORS
The use of a bulk capacitor is recommended to improve power supply stability. Typical values range from 4.7 µF to
47 µF. This capacitor should be located as close to the device as possible.
3.3 Capacitor on Internal Voltage Regulator (VCAP)
3.3.1 INTERNAL REGULATOR MODE
A low-ESR (1 Ohm) capacitor is required on the VCAP pin, which is used to stabilize the internal voltage regulator output.
The VCAP pin must not be connected to VDD, and must have a CEFC capacitor, with at least a 6V rating, connected to
ground. The type can be ceramic or tantalum. Refer to Section 4.0 “Electrical Characteristics” for additional informa-
tion on C
EFC specifications.
VDD
VSS
VSS
VDD
AVDD
AVSS
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
C
(3)
R
V
DD
MCLR#
R1
(3)
Note 1: Aluminum or electrolytic capacitors should not be
used. ESR 3W from -40ºC to 125ºC @ SYSCLK
frequency (i.e., MIPS)
2: Recommended components. See Figure 3-2.
VCAP
Tantalum or
ceramic 10 µF
ESR 3Ω
(2)
SSC7150

SSC7150-ML-AB0

Mfr. #:
Manufacturer:
Microchip Technology
Description:
Sensor Interface Motion Coprocessor
Lifecycle:
New from this manufacturer.
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