ADuM120N/ADuM121N Data Sheet
Rev. B | Page 10 of 19
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
AC SPECIFICATIONS
Output Rise/Fall Time t
R
/t
F
2.5 ns 10% to 90%
Common-Mode Transient Immunity
6
|CM
H
| 75 100 kV/µs V
Ix
= V
DDx
, V
CM
= 1000 V, transient
magnitude = 800 V
|CM
L
| 75 100 kV/µs V
Ix
= 0 V, V
CM
= 1000 V, transient
magnitude = 800 V
1
I
Ox
is the Channel x output current, where x = A or B.
2
V
IxH
is the input side logic high voltage.
3
V
IxL
is the input side logic low voltage.
4
V
I
is the input voltage.
5
N0 is the ADuM120N0/ADuM121N0 models, N1 is the ADuM120N1/ADuM121N1 models. See the Ordering Guide.
6
|CM
H
| is the maximum common-mode voltage slew rate that can be sustained while maintaining V
O
> 0.8 V
DDx
. |CM
L
| is the maximum common-mode voltage slew rate
that can be sustained while maintaining V
O
> 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
Table 8. Total Supply Current vs. Data Throughput
1 Mbps 25 Mbps 100 Mbps
Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit
SUPPLY CURRENT
ADuM120N
Supply Current Side 1 I
DD1
3.4 6.0 3.8 6.4 5.2 8.4 mA
Supply Current Side 2 I
DD2
1.2 1.8 1.9 2.8 4.0 5.8 mA
ADuM121N
Supply Current Side 1 I
DD1
2.4 4.7 2.8 5.5 4.4 7.8 mA
DD2
INSULATION AND SAFETY RELATED SPECIFICATIONS
For additional information, see www.analog.com/icouplersafety.
Table 9.
Parameter Symbol Value Unit Test Conditions/Comments
Rated Dielectric Insulation Voltage 3000 V rms 1-minute duration
Minimum External Air Gap (Clearance) L (I01) 4.0 mm min Measured from input terminals to output terminals,
shortest distance through air
Minimum External Tracking (Creepage) L (I02) 4.0 mm min Measured from input terminals to output terminals,
shortest distance path along body
Minimum Clearance in the Plane of the Printed
Circuit Board (PCB Clearance)
L (PCB) 4.5 mm min Measured from input terminals to output terminals,
shortest distance through air, line of sight, in the PCB
mounting plane
Minimum Internal Gap (Internal Clearance) 25.5 µm min Insulation distance through insulation
Tracking Resistance (Comparative Tracking Index)
DIN IEC 112/VDE 0303 Part 1
Material Group II Material Group (DIN VDE 0110, 1/89, Table 1)
PACKAGE CHARACTERISTICS
Table 10.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
Resistance (Input to Output)
1
R
I-O
10
13
Ω
Capacitance (Input to Output)
1
C
I-O
2 pF f = 1 MHz
Input Capacitance
2
C
I
4.0 pF
IC Junction to Ambient Thermal Resistance θ
JA
80 °C/W Thermocouple located at center of package underside
1
The device is considered a 2-terminal device: Pin 1 through Pin 4 are shorted together, and Pin 5 through Pin 8 are shorted together.
2
Input capacitance is from any input data pin to ground.
