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AT45DB1282
2472C–DFLSH–11/03
Figure 2. Algorithm for Randomly Modifying Data
Notes: 1. To preserve data integrity, each page of a DataFlash sector must be updated/rewritten at least once within every 2,000
cumulative page erase/program operations.
2. A Page Address Pointer must be maintained to indicate which page is to be rewritten.
3. Other algorithms can be used to rewrite portions of the Flash array. Low-power applications may choose to wait until 2,000
cumulative page erase/program operations have accumulated before rewriting all pages of the sector. See application note
AN-4 (“Using Atmels Serial DataFlash”) for more details.
BUFFER WRITE
(84h, 87h)
PAGE ERASE
(81h)
BUFFER TO MAIN
MEMORY PAGE PROGRAM
(88h, 89h) or (98h, 99h)
START
MAIN MEMORY PAGE
TO BUFFER TRANSFER
(53h, 55h)
provide address of
page to modify
If planning to modify multiple
bytes currently stored within
a page of the Flash array
INCREMENT PAGE
ADDRESS POINTER
(2)
END
Sector Addressing
PA13 PA12 PA11 PA10 PA9 PA8 PA7 PA6 PA5 PA4 PA3 PA2 - PA0 Sector
00000000000 X 0
000000XXXXX X 1
000001XXXXX X 2
000010XXXXX X 3
•••••••••••
•••••••••••
•••••••••••
111100XXXXX X 61
111101XXXXX X 62
111110XXXXX X 63
111111XXXXX X 64
32
AT45DB1282
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Note: 1. RapidS Serial Interface.
Ordering Information
f
SCK
(MHz)
I
CC
(mA)
Ordering Code Package
Operation RangeActive Standby
40
(1)
20
(1)
0.015 AT45DB1282-TC 40T
Commercial
(0°C to 70°C)
40
(1)
20
(1)
0.015 AT45DB1282-TI 40T
Industrial
(-40°C to 85°C)
40
(1)
20
(1)
0.015 AT45DB1282-CC 44C2
Commercial
(0°C to 70°C)
40
(1)
20
(1)
0.015 AT45DB1282-CI 44C2
Industrial
(-40°C to 85°C)
Package Type
40T 40-lead, (10 x 20 mm) Plastic Thin Small Outline Package, Type I (TSOP)
44C2 44-ball, (8 x 12 mm) Plastic Chip-size Ball Grid Array Package (CBGA)
33
AT45DB1282
2472C–DFLSH–11/03
Packaging Information
40T – TSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
40T, 40-lead (10 x 20 mm Package) Plastic Thin Small Outline
Package, Type I (TSOP)
B
40T
10/18/01
PIN 1
D1
D
Pin 1 Identifier
b
e
E
A
A1
A2
0º ~ 8º
c
L
GAGE PLANE
SEATING PLANE
L1
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This package conforms to JEDEC reference MO-142, Variation CD.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
A 1.20
A1 0.05 0.15
A2 0.95 1.00 1.05
D 19.80 20.00 20.20
D1 18.30 18.40 18.50 Note 2
E 9.90 10.00 10.10 Note 2
L 0.50 0.60 0.70
L1 0.25 BASIC
b 0.17 0.22 0.27
c 0.10 0.21
e 0.50 BASIC

AT45DB1282-TC

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
NOR Flash 128M bit
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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