AR0134CS
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PACKAGE DIMENSIONS
IBGA63 9x9
CASE 503AG
ISSUE O
Notes:
1. Dimensions in mm.
Dimensions in () are for reference only.
2. Encapsulant: Epoxy.
3. Substrate material: Plastic laminate 0.25 thickness.
4. Lid material: Borosilicate glass 0.4 ±0.04 thickness.
5. Refractive index at 20C = 1.5255 @ 546 nm and
1.5231 @ 588 nm.
6. Double side AR Coating: 530−570 nm R< 1%;
420−700 nm R < 2%.
7. Image sensor die: 0.2 mm thickness.
8. Solder ball material: SAC305 (95% Sn, 3% Ag,
0.5% Cu).
9. Dimensions apply to solder balls post reflow.
Pre-flow ball is 0.5 on a ∅0.4 SMD ball pad.
10.Maximum rotation of optical area relative to pack-
age edges: 1°.
11. Maximum tilt of optical area relative to substrate
plane D: 25 mm.
12.Maximum tilt of cover glass relative to optical area
plane E: 50 mm.
