LT3782A
16
3782afc
For more information www.linear.com/LT3782A
Typical applicaTions
12V Input to 24V at 8.5A Output Synchronous Boost Converter
C2
0.1µF
C3
2.2nF
C4
22pF
R3
10Ω
27
26
25
24
23
22
21
20
19
18
17
16
15
28
2
3
4
5
6
7
8
9
10
11
12
13
14
1
R2
60.4k
R5
23.7k
R6
56.2k
C9
2.2nF
C
C2
220pF
C
C1
6.8nF
R
C1
15k
R1
10Ω
3782A TA04
V
CC1
GND
GND
V
EE1
BGATE1 BG1
BG2
GBIAS1
GBIAS2
BGATE2
V
EE2
GND
RUN RUN
FB = 2.44V
V
C
GBIAS
SGATE1
GND
GND
SYNC
DELAY
DCL
SENSE1
+
SENSE1
+
SENSE1
SLOPE
R
SET
SENSE2
SENSE2
+
SS
SGATE2
SGATE1
SGATE2
SENSE1
SENSE2
+
SENSE2
SENSE2
+
LT3782A
SENSE2
R
FB1
475k
V
OUT
R4
53.6k
C1
2.2µF
L2
8.3µH
L1
8.3µH
C8
2.2µF
C5
1µF
D4
PD3S160
DFLS160
C6
1µF
C12
0.001µF
R
B
825k
RUN
V
IN
R7
402k
Q4
HAT2172H
Q5
HAT2172H
BG2BG2
R
S3
0.006Ω
R
S4
0.006Ω
TG
TS
BST
GND
IN
V
CC
LTC4440-5
2
3
1
5
4
6
SGATE2
5V
SENSE1
SENSE1
+
Q1
HAT2172H
Q2
HAT2172H
BG1BG1
0.006Ω0.006Ω
C10
1µF
D3
PD3S160
D1
DFLS160
C13
10µF
×4
C11
330µF
×4
V
OUT
24V AT 8.5A
C7
1µF
Q6
HAT2166H
TG
TS
BST
GND
IN
V
CC
LTC4440-5
2
3
1
5
4
6
SGATE1
5V
10µF
×2
V
IN
10V TO 14V
HAT2166H
+
330µF
×2
+
LT3782A
17
3782afc
For more information www.linear.com/LT3782A
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation EB
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
FE28 (EB) TSSOP REV K 0913
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1 3 4
5
6
7
8 9 10
11
12 13 14
192022 21 151618 17
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
2.74
(.108)
28 27 26 2524 23
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
4.75
(.187)
2.74
(.108)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation EB
LT3782A
18
3782afc
For more information www.linear.com/LT3782A
UFD Package
28-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1712 Rev B)
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
4.00 ±0.10
(2 SIDES)
2.50 REF
5.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ±0.10
27 28
1
2
BOTTOM VIEW—EXPOSED PAD
3.50 REF
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
PIN 1 NOTCH
R = 0.20 OR 0.35
× 45° CHAMFER
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFD28) QFN 0506 REV B
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.50 REF
3.50 REF
4.10 ±0.05
5.50 ±0.05
2.65 ±0.05
3.10 ±0.05
4.50 ±0.05
PACKAGE OUTLINE
2.65 ±0.10
3.65 ±0.10
3.65 ±0.05
UFD Package
28-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1712 Rev B)

LT3782AEFE#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 2-PhBoost DC/DC Cntr
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union