7
LTC3738
3738f
Maximum Current Threshold
Mismatch vs Temperature
(V
AVP
– V
IN
+
) vs
(V
SENSE
+
– V
SENSE
)
Shed Mode at 1A,
Light Load Current
TEMPERATURE (°C)
–45
0
0.5
1.0
MAXIMUM CURRENT THRESHOLD MISMATCH (mV)
3.0
45
3738 G19
1.5
2.5
2.0
–30
90
0
–15
15
75
30
60
V
SENSE
+
– V
SENSE
(mV)
–15
V
AVP
– V
IN
+
(mV)
90
135
180
45
3738 G20
45
0
–45
0
15
30
60
V
OUT
10mV/DIV
V
SW1
5V/DIV
V
SW2
5V/DIV
V
SW3
5V/DIV
2µs/DIVV
IN
= 12V
V
OUT
= 1.5V
V
FCB
= V
CC
FREQUENCY = 210kHz
3738 G21
Pulse Skip Mode at 1A,
Light Load Current
Load Transient with AVP
V
OUT
10mV/DIV
V
SW1
5V/DIV
V
SW2
5V/DIV
V
SW3
5V/DIV
2µs/DIVV
IN
= 12V
V
OUT
= 1.5V
V
FCB
= OPEN
FREQUENCY = 210kHz
3738 G22
Continuous Mode at 1A,
Light Load Current
V
OUT
10mV/DIV
V
SW1
5V/DIV
V
SW2
5V/DIV
V
SW3
5V/DIV
2µs/DIVV
IN
= 12V
V
OUT
= 1.5V
V
FCB
= GND
FREQUENCY = 210kHz
3738 G23
V
OUT
50mV/DIV
3738 G24
V
IN
= 12V
V
OUT
= 1.35V
C
OUT
= 10 × 330µF/2.5V
SANYO TPE POSCAP
+ 18 × 22µF/X5R CERAMIC
I
OUT
100A STEP
dI/dt > 200A/µs
80mV
INTEL
SPEC
TYPICAL PERFOR A CE CHARACTERISTICS
UW
T
A
= 25°C unless otherwise noted.
8
LTC3738
3738f
UU
U
PI FU CTIO S
FCB/SYNC (Pin 1): Forced Continuous Control Input. The
voltage applied to this pin sets the operating mode of the
controller. The forced continuous current mode is active
when the applied voltage is less than 0.6V. Pulse skip
mode operation will be active when the pin is allowed to
float and Stage Shedding mode will be active if the pin is
tied to the V
CC
pin. When an external clock is present, the
controller will be synchronized to the external clock and
forced continuous mode is selected internally. (Do not
apply voltage to this pin prior to the application of voltage
on the V
CC
pin.)
PLLFLTR (Pin 2): The phase-locked loop’s lowpass filter
is tied to this pin. Alternatively, this pin can be driven with
an AC or DC voltage source to vary the frequency of the
internal oscillator. (Do not apply voltage to this pin prior to
the application of voltage on the V
CC
pin.)
IN
+
, IN
(Pins 4, 3): Inputs to a Precision, Unity-Gain
Differential Amplifier with Internal Precision Resistors.
This provides true remote sensing of both the positive and
negative load terminals for precise output voltage control.
AVP (Pin 5): Active Voltage Positioning Load Slope Pro-
gramming Pin. A resistor tied between this pin and IN
+
sets the load slope.
EAIN (Pin 6): This is the input to the error amplifier which
compares the VID divided feedback voltage to the internal
0.6V reference voltage.
SENSE1
+
, SENSE2
+
, SENSE3
+
, SENSE1
, SENSE2
,
SENSE3
(Pins 7 to 12): The Inputs to Each Differential
Current Comparator. The I
TH
pin voltage and built-in
offsets between the SENSE
and SENSE
+
pins, in conjunc-
tion with R
SENSE
, set the current trip threshold level.
SS (Pin 13): Combination of Soft-Start and Short-Circuit
Detection Timer. A capacitor to ground at this pin sets the
ramp time to full current output as well as the time delay
prior to an output voltage short-circuit shutdown.
I
TH
(Pin 14): Error Amplifier Output and Switching Regu-
lator Compensation Point. All three current comparator’s
thresholds increase with this control voltage.
TSNS (Pin 15): This pin selects external or internal ther-
mal detection. Tying this pin to V
CC
will enable the internal
thermal detector. When the voltage at this pin is less than
V
CC
– 1.6V, the internal thermal detector is disabled and
this pin serves as the input to an internal comparator
which is referenced to V
CC
/3.
VR_HOTB (Pin 16): This open-collector output is pulled
low when voltage at the TSNS pin is less than V
CC
/3. If
TSNS is tied to V
CC
, this pin is pulled low when the internal
thermal detector is tripped.
PGND (Pin 24): Driver Power Ground. This pin connects
to the sources of the bottom N-channel external MOSFETs
and the (–) terminals of C
IN
.
BG1, BG2, BG3 (Pins 25, 23, 22): High Current Gate
Drives for the Bottom N-Channel MOSFETs. Voltage swing
at these pins is from ground to V
CC
.
V
CC
(Pin 26): Main Supply Pin. Because this pin supplies
both the controller circuit power as well as the high power
pulses supplied to drive the external MOSFET gates, this
pin needs to be very carefully and closely decoupled to the
IC’s PGND pin.
9
LTC3738
3738f
UU
U
PI FU CTIO S
SW1, SW2, SW3 (Pins 30, 27, 21): Switch Node Connec-
tions to Inductors. Voltage swing at these pins is from a
Schottky diode (external) voltage drop below ground to
V
IN
(where V
IN
is the external MOSFET supply rail).
TG1, TG2, TG3 (Pins 31, 28, 20): High Current Gate Drives
for Top N-Channel MOSFETs. These are the outputs of the
floating drivers with a voltage swing equal to the boost
voltage source superimposed on the switch node voltage
SW.
BOOST1, BOOST2, BOOST3 (Pins 32, 29, 19): Positive
Supply Pins to the Topside Floating Drivers. Bootstrapped
capacitors, charged with external Schottky diodes and a
boost voltage source are connected between the BOOST and
SW pins. Voltage swing at the BOOST pins is from the boost
source voltage (typically V
CC
) to this boost source voltage
+V
IN
(where V
IN
is the external MOSFET supply rail).
PGOOD (Pin 33): This open-drain output is pulled low
when the output voltage is outside the PGOOD tolerance
window. PGOOD is blanked during VID transitions for
approximately 100µs.
VID0, VID1, VID2, VID3, VID4, VID5 (Pins 35, 36, 37, 17,
18, 34): Output Voltage Programming Input Pins. When
VID5 is tied to V
CC
, the Intel VRM9 VID table is selected.
When voltage of VID5 is less than V
CC
– 2V, VID5 serves
as the fifth VID bit of VRM10.
OUTEN (Pin 38): On/Off Control of the Controller.
SGND (Pin 39, Exposed Pad): Signal Ground. This pin
must be soldered to the ground plane.

LTC3738CUHF#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 3-Phase VRM10/VRM9 Synch. Controller
Lifecycle:
New from this manufacturer.
Delivery:
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