74HC_HCT7403_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 21 September 2012 16 of 32
NXP Semiconductors
74HC7403-Q100; 74HCT7403-Q100
4-bit x 64-word FIFO register; 3-state
Measurement points are given in Table 7.
V
OL
and V
OH
are typical voltage output levels that occur with the output load.
(1) DOR HIGH; no data transfer in progress, valid data is present at the output stage
(2) SO
set HIGH; result in DOR going LOW
(3) DOR goes LOW; output stage “busy”
(4) SO
set LOW; data in the input stage is unloaded, and new data replaces it as empty location “bubbles-up” to input stage
(5) DOR goes HIGH; transfer process completed, valid data present at output after the specified propagation delay
(6) Repeat process to unload the 3
rd
through the 64
th
word from FIFO
(7) DOR remains LOW; FIFO is empty
Fig 9. Propagation delay SO input to DOR output, the SO pulse width and the SO maximum frequency.
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74HC_HCT7403_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 21 September 2012 17 of 32
NXP Semiconductors
74HC7403-Q100; 74HCT7403-Q100
4-bit x 64-word FIFO register; 3-state
Measurement points are given in Table 7.
V
OL
and V
OH
are typical voltage output levels that occur with the output load.
With FIFO empty; SO
is held HIGH in anticipation
(1) FIFO is initially empty. SO
is held HIGH.
(2) SI pulse; loads data into FIFO and initiates ripple through process
(3) DOR flag signals the arrival of valid data at the output stage
(4) Output transition; data arrives at output stage after the specified propagation delay between the rising and falling edge of the
DOR pulse to the Qn output
(5) DOR goes LOW; data shift-out is completed, FIFO is empty again
(6) SO
set LOW; necessary to complete shift-out process. DOR remains LOW, because FIFO is empty
Fig 10. Ripple through delay SI input to DOR output, propagation delay DOR input to Qn outputs and the DOR
pulse width
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:
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3/+
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3+/
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3/+
Measurement points are given in Table 7.
V
OL
and V
OH
are typical voltage output levels that occur with the output load.
Shift-in operation; high speed burst mode
In the high-speed mode, the burst-in rate is determined by the minimum shift-in HIGH and shift-in LOW specifications. The DIR
status flag is a “don’t care” condition, and a shift-in pulse can be applied regardless of the flag. An SI pulse which would
overflow the storage capacity of the FIFO is ignored.
Fig 11. Shift-in (SI) pulse width and maximum frequency (SI)
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74HC_HCT7403_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 21 September 2012 18 of 32
NXP Semiconductors
74HC7403-Q100; 74HCT7403-Q100
4-bit x 64-word FIFO register; 3-state
Measurement points are given in Table 7.
V
OL
and V
OH
are typical voltage output levels that occur with the output load.
Shift-out operation; high speed burst mode
In the high-speed mode, the burst-out rate is determined by the minimum shift-out HIGH and shift-out LOW specifications. The
DOR flag is a “don’t care” condition, and an SO
pulse can be applied without regard to the flag.
Fig 12. Shift-in (SO) pulse width and maximum frequency (SO)
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Measurement points are given in Table 7.
V
OL
and V
OH
are typical voltage output levels that occur with the output load.
The shaded areas indicate when the output is permitted to change for predictable output performance
Fig 13. Set-up and hold times
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9
0
Measurement points are given in Table 7.
V
OL
and V
OH
are typical voltage output levels that occur with the output load.
Fig 14. Propagation delay shift-out input (SO) to data outputs (Qn) and output transition time
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74HC7403D-Q100,518

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC FIFO REGISTER 4X64 3ST 16SOIC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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