NCP1606
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19
BOOST DESIGN EQUATIONS Components are identified in Figure 1
RMS Input Current
I
ac(rms)
+
P
OUT
h @ V
ac(rms)
h (the efficiency of only the Boost
PFC stage) is generally in the range
of 90 95%
Maximum Inductor Peak
Current
I
pk(max)
+
2 @ 2
Ǹ
@ P
OUT
h @ Vac
LL
I
pk(max)
occurs at the lowest line
voltage.
Inductor Value
L v
2 @ Vac
2
@
ǒ
V
OUT
2
Ǹ
* Vac
Ǔ
V
OUT
@ Vac @ I
pk(max)
@ f
SW(min)
f
SW(min)
is the minimum desired
switching frequency. The maximum L
must be calculated at low line and
high line.
Maximum On Time
t
ON(max)
+
2 @ L @ P
OUT
h @ Vac
LL
2
The maximum on time occurs at the
lowest line voltage and maximum
output power.
Off Time
t
OFF
+
t
ON
V
OUT
Vac
(rms)
@
Ť
sin(q)
Ť
@ 2
Ǹ
* 1
The off time is greatest at the peak of
the AC line voltage and approaches
zero at the AC line zero crossings.
Theta (q) represents the angle of the
AC line voltage.
Frequency
f
SW
+
Vac
(rms)
2
@ h
2 @ L @ P
OUT
@
ǒ
1 *
Vac
(rms)
@
|
sin q
|
@ 2
Ǹ
V
OUT
Ǔ
Pin 3 Capacitor
Ct w
2 @ P
OUT
@ L @ I
CHARGE
h @ Vac
RMS
2
@ V
CTMAX
I
CHARGE
and V
CTMAX
are given in
the NCP1606 specification table.
Boost Turns to ZCD Turns
Ratio
N
B
:N
ZCD
v
V
OUT
* Vac
HL
@ 2
Ǹ
V
ZCDH
The turns ratio must be low enough
so as to trigger the ZCD comparators
at high line.
Resistor from ZCD wind-
ing to the ZCD pin (pin 5)
R
ZCD
w
Vac
HL
@ 2
Ǹ
I
CL(NEG)
@ (N
B
:N
ZCD
)
R
ZCD
must be large enough so that
the shutdown comparator is not inad-
vertently activated.
Boost Output Voltage
V
OUT(nom)
+ 2.5 V @
R
OUT1
) R
OUT2
R
OUT2
Maximum V
OUT
voltage
prior to OVP activation and
the necessary R
OUT1
and
R
OUT2
.
V
OUT(max)
+ V
OUT(nom)
) R
OUT1
@ I
OVP
R
OUT1
+
V
OUT(max)
* V
OUT(nom)
I
OVP
R
OUT2
+
2.5 V @ R
OUT1
V
OUT(nom)
* 2.5 V
I
OVP
is given in the NCP1606 spe-
cification table. I
OVP
is lower for the
NCP1606B, then for the NCP1606A
version.
Minimum output voltage
necessary to exit under-
voltage protection (UVP)
V
OUT
(UVP)
+
R
OUT1
) R
OUT2
R
OUT2
@ V
UVP
V
UVP
is given in the NCP1606 spe-
cification table.
Bulk Cap Ripple
Vripple
(pkpk)
+
P
OUT
C
bulk
@ 2 @ p @ f
line
@ V
OUT
Use f
line
= 47 Hz for worst case at
universal lines. The ripple must not
exceed the OVP level for V
OUT
.
Inductor RMS Current
Icoil
RMS
+
2 @ P
OUT
3
Ǹ
@ Vac
LL
@ h
Boost Diode RMS Current
Id
MAX(rms)
+
4
3
@
2 @ 2
Ǹ
p
Ǹ
@
P
OUT
h @ Vac
LL
@ V
OUT
Ǹ
MOSFET RMS Current
I
M(rms)
+
2
3
Ǹ
@
Pin
Vac
@ 1 *
ǒ
8 @ 2
Ǹ
@ Vac
3 p @ V
OUT
Ǔ
Ǹ
NCP1606
http://onsemi.com
20
BOOST DESIGN EQUATIONS Components are identified in Figure 1
MOSFET Sense Resistor
R
SENSE
+
V
CS(limit)
I
pk
P
RSENSE
+ I
M(rms)
2
@ R
SENSE
V
CS(limit)
is given in the NCP1606
specification table. The NCP1606B
has a lower V
CS(limit)
level.
Bulk Capacitor RMS
Current
I
C(rms)
+
32 @ 2
Ǹ
@ P
OUT
2
9 @ p @ Vac
LL
@ V
OUT
@ h
2
* (I
LOAD(rms)
)
2
Ǹ
Type 1 C
COMP
C
COMP
+
10
Gń20
4 @ p @ f
line
@ R
OUT1
G is the desired attenuation in
decibels (dB). Typically it is 60 dB.
ORDERING INFORMATION
Device Vcs(limit) (typ) (Note 5) I
OVP
(typ) (Note 5) Package Shipping
NCP1606APG 1.7 V 40 mA PDIP8 50 Units / Rail
NCP1606ADR2G 1.7 V 40 mA SOIC8 2500 / Tape & Reel
NCP1606BPG 0.5 V 10 mA PDIP8 50 Units / Rail
NCP1606BDR2G 0.5 V 10 mA SOIC8 2500 / Tape & Reel
5. See the electrical specifications section for complete information on V
CS
and I
OVP
.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
NCP1606
http://onsemi.com
21
PACKAGE DIMENSIONS
SOIC8 NB
CASE 75107
ISSUE AJ
SEATING
PLANE
1
4
58
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010) Z
S
X
S
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒ
mm
inches
Ǔ
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*

NCP1606BDR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Power Factor Correction - PFC PWR FCTR CONTROLLER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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