HMC903LP3E Data Sheet
Rev. H | Page 10 of 13
APPLICATIONS INFORMATION
Figure 22 shows the basic connections for operating the
HMC903LP3E. Both the RFIN and RFOUT ports have on-chip
dc block capacitors that eliminate the need for external ac
coupling capacitors.
The HMC903LP3E has V
GG1
and V
GG2
optional gate bias pins.
When these pins are left open, the amplifier runs in self biased
operation with a typical I
DQ
= 80 mA, when V
DD1
/V
DD2
= 3.5 V.
When using the V
GG1
and V
GG2
gate bias pins, follow the
recommended bias sequencing so that the amplifier is not
damaged.
RECOMMENDED BIAS SEQUENCE DURING
POWER UP
The recommended bias sequence to power up the
HMC903LP3E is as follows:
1. Connect to GND.
2. Set V
GG1
and V
GG2
to −2 V.
3. Set V
DD1
and V
DD2
to 3.5 V.
4. Increase V
GG1
and V
GG2
to achieve a typical I
DQ
= 80 mA.
5. Apply the RF signal.
RECOMMENDED BIAS SEQUENCE DURING POWER
DOWN
The recommended bias sequence to power down the
HMC903LP3E is as follows:
1. Turn off t he RF signal.
2. Decrease V
GG1
and V
GG2
to −2 V to achieve a typical I
DQ
=
0 mA.
3. Decrease V
DD1
and V
DD2
to 0 V.
4. Increase V
GG1
and V
GG2
to 0 V.
Unless otherwise noted, all measurements and data shown were
taken using the typical application circuit (see Figure 23), with
the evaluation board (see Figure 22) and biased per the conditions
in this section. The V
DD1
and V
DD2
pins are connected together;
similarly, the V
GG1
and V
GG2
pins are also connected together. The
bias conditions shown in this section are the operating points
recommended to optimize the overall performance. Operation
using other bias conditions may provide performance that differs
from what is shown in this data sheet.
Decreasing the V
DD1
and V
DD2
levels has negligible effect on the
gain and noise figure performance; however, they reduce the
P1dB. This behavior is shown in Figure 8 to Figure 20. For
applications where the P1dB requirement is not stringent, the
HMC903LP3E can be down biased to reduce power
consumption.
Data Sheet HMC903LP3E
Rev. H | Page 11 of 13
EVALUATION PCB
The circuit board used in this application must use RF circuit
design techniques. Signal lines must have 50 Ω impedance, and
the package ground leads and exposed paddle must be connected
directly to the ground plane similar to that shown in Figure 22.
Use a sufficient number of via holes to connect the top and
bottom ground planes. Mount the evaluation PCB to an
appropriate heat sink. The evaluation PCB shown is available
from Analog Devices, Inc., upon request.
14479-022
Figure 22. Evaluation PCB (128395-1)
Table 6. List of Materials for the Evaluation PCB
Component Description
J1, J2 SMA connectors
J3, J4, J6 to J8 DC pins
C1, C4, C7, C10 100 pF capacitors, 0402 package
C2, C5, C8, C11 0.01 µF capacitors, 0402 package
C3, C6, C9, C12 4.7 µF tantalum capacitors
U1
HMC903LP3E amplifier
PCB 128395-1 evaluation PCB; circuit board material: Rogers 4350 or Arlon 25FR
HMC903LP3E Data Sheet
Rev. H | Page 12 of 13
TYPICAL APPLICATION CIRCUITS
1
2
3
4
RFIN RFOUT
12
11
10
9
16
15
14
13
5
6
7
8
V
DD1
C9
4.7µF
+
C8
0.01µF
C7
100pF
V
DD2
C10
100pF
+
C11
0.01µF
C12
4.7µF
C1
100pF
C4
100pF
14479-023
Figure 23. Standard (Self Biased) Operation Typical Application Circuit
1
2
3
4
RFIN RFOUT
12
11
10
9
16
15
14
13
5
6
7
8
V
DD1
C9
4.7µF
+
C8
0.01µF
C7
100pF
V
DD2
C10
100pF
+
C11
0.01µF
C12
4.7µF
V
GG1
C6
4.7µF
+
C5
0.01µF
C4
100pF
V
GG2
C1
100pF
+
C2
0.01µF
C3
4.7µF
14479-024
Figure 24. Gate Control, Reduced Current Operation Typical Application Circuit

HMC903LP3ETR

Mfr. #:
Manufacturer:
Analog Devices / Hittite
Description:
RF Amplifier LNA, HIP3, 6-18GHz
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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