Data Sheet HMC903LP3E
Rev. H | Page 13 of 13
OUTLINE DIMENSIONS
3.10
3.00 SQ
2.90
0.30
0.25
0.20
1.95
1.70 SQ
1.50
1
0.50
BSC
BOTTOM VIEWTOP VIEW
16
58
9
12
13
4
EXPOSED
PAD
0.45
0.40
0.35
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.90
0.85
0.80
03-15-2017-B
PKG-004863
COMPLIANT WITH JEDEC STANDARDS MO-220-VEED-4.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
SEATING
PLANE
P
I
N
1
I
N
D
I
C
A
T
O
R
A
R
E
A
O
P
T
I
O
N
S
(
S
E
E
D
E
T
A
I
L
A
)
DETAIL A
(JEDEC 95)
Figure 25. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.85 mm Package Height
(HCP-16-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Lead Finish Package Description Package Option
HMC903LP3E −40°C to +85°C 100% Matte Sn 16-Lead LFCSP HCP-16-1
HMC903LP3ETR −40°C to +85°C 100% Matte Sn 16-Lead LFCSP HCP-16-1
129798-HMC903LP3E Evaluation Board
1
The HMC903LP3E and the HMC903LP3ETR are RoHS Compliant Parts.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14479-0-2/18(H)
