NDS8852H Datasheet NDS8852H | P7-P9

NDS8852H Rev. C1

0 2 4 6 8 10

I , DRAIN CURRENT (A)

g , TRANSCONDUCTANCE (SIEMENS)

T = -55°C

25°C

V =10V

125°C

-10-8-6-4-20

I , DRAIN CURRENT (A)

g , TRANSCONDUCTANCE (SIEMENS)

T = -55°C

25°C

125°C

V = -10V

Typical Electrical and Thermal Characteristics

Figure 22. P-Channel Transconductance Variation

with Drain Current and Temperature.

Figure 21. N-Channel Transconductance Variation

with Drain Current and Temperature.

0 0.2 0.4 0.6 0.8 1

0.5

1.5

2.5

2oz COPPER MOUNTING PAD AREA (in )

STEADY-STATE POWER DISSIPATION (W)

4.5"x5" FR-4 Board

T = 25 C

Still Air

Figure 23. SO-8 Single Device DC Power Dissipation

versus Copper Mounting Pad Area.

0.2 0.4 0.6 0.8 1 1.2 1.4

0.001

0.01

0.1

0.5

V , BODY DIODE FORWARD VOLTAGE (V)

I , REVERSE DRAIN CURRENT (A)

T = 125°C

25°C

-55°C

V = 0V

Figure 19. N-Channel Body Diode Forward

Voltage Variation with Current and

Temperature.

0.2 0.4 0.6 0.8 1 1.2 1.4

0.001

0.01

0.1

0.5

-V , BODY DIODE FORWARD VOLTAGE (V)

-I , REVERSE DRAIN CURRENT (A)

T = 125°C

25°C

-55°C

V = 0V

Figure 20. P-Channel Body Diode Forward

Voltage Variation with Current and

Temperature.

NDS8852H Rev. C1

Typical Thermal Characteristics

0.1 0.2 0.5 1 2 5 10 30 50

0.01

0.03

0.1

0.3

V , DRAIN-SOURCE VOLTAGE (V)

I , DRAIN CURRENT (A)

10ms

100ms

10s

1ms

RDS(ON) LIMIT

100us

V = 10V

SINGLE PULSE

R = See Note 1c

T = 25°C

0.1 0.2 0.5 1 2 5 10 30 50

0.01

0.03

0.1

0.3

- V , DRAIN-SOURCE VOLTAGE (V)

-I , DRAIN CURRENT (A)

RDS(ON) LIMIT

100ms

10s

10ms

1ms

100us

V = -10V

SINGLE PULSE

R = See Note 1c

T = 25°C

Figure 26. N-Ch Maximum Safe Operating

Area.

Figure 27. P-Ch Maximum Safe Operating

Area.

0 0.2 0.4 0.6 0.8 1

2oz COPPER MOUNTING PAD AREA (in )

-I , STEADY-STATE DRAIN CURRENT (A)

4.5"x5" FR-4 Board

T = 25 C

Still Air

V = -10V

Figure 25. P-Ch Maximum Steady-State Drain

Current versus Copper Mounting Pad Area.

0 0.2 0.4 0.6 0.8 1

2oz COPPER MOUNTING PAD AREA (in )

I , STEADY-STATE DRAIN CURRENT (A)

4.5"x5" FR-4 Board

T = 25 C

Still Air

V = 10V

Figure 24. N-Ch Maximum Steady-State Drain

Current versus Copper Mounting Pad Area.

0.0001 0.001 0.01 0.1 1 10 100 300

0.001

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

t , TIME (sec)

TRANSIENT THERMAL RESISTANCE

r(t), NORMALIZED EFFECTIVE

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t / t

R (t) = r(t) * R

R = See Note 1c

T - T = P * R (t)

P(pk)

Figure 28. Transient Thermal Response Curve.

Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change

depending on the circuit board design.

SOIC(8lds) Packaging

Configuration: Figure 1.0

Components

Leader Tape

1680mm minimum or

210 empty pockets

Trailer Tape

640mm minimum or

80 empty pockets

SOIC(8lds) Tape Leader and Trailer

Configuration: Figure 2.0

Cover Tape

Carrier Tape

Note/Comments

Packaging Option

SOIC (8lds) Packaging Information

Standard

(no flow code)

L86Z F011

Packaging type

Reel Size

TNR

13" Dia

Rail/Tube

TNR

13" Dia

Qty per Reel/Tube/Bag

2,500 95 4,000

Box Dimension (mm)

343x64x343 530x130x83 343x64x343

Max qty per Box

5,000 30,000 8,000

D84Z

TNR

7" Dia

500

184x187x47

1,000

Weight per unit (gm)

0.0774 0.0774 0.0774 0.0774

Weight per Reel (kg)

0.6060 - 0.9696 0.1182

F63TN Label

ESD Label

343mm x 342mm x 64mm

Standard Intermediate box

ESD Label

F63TNR Label sample

F63TNLabel

LOT: CBVK741B019

FSID: FDS9953A

D/C1: D9842 QTY1: SPEC REV:

SPEC:

QTY: 2500

D/C2: QTY2: CPN:

N/F: F (F63TNR)3

852

NDS

9959

SOIC-8 Unit Orientation

852

NDS

9959

Pin 1

Static Dissipative

Embossed Carrier Tape

F63TNR

Label

Antistatic Cover Tape

ESD Label

ELECTROSTATIC

SENSITIVE DEVICES

DO NOT SHIP OR STORE NEAR STRONG ELECTROSTATIC

ELECTROMAGNETIC, MAGNETIC OR R ADIOACTIVE FIELDS

TNR DATE

PT NUM BER

PEEL STRENGTH MIN _________ __ ___gms

MAX _____________ gms

Customized

Label

Packaging Description:

SOIC-8 parts are shipped in tape. The carrier tape is

made from a dissipative (carbon filled) polycarbonate

resin. The cover tape is a multilayer film (Heat Activated

Adhesive in nature) primarily composed of polyester film,

adhesive layer, sealant, and anti-static sprayed agent.

These reeled parts in standard option are shipped with

2,500 units per 13" or 330cm diameter reel. The reels are

dark blue in color and is made of polystyrene plastic (anti-

static coated). Other option comes in 500 units per 7" or

177cm diameter reel. This and some other options are

further described in the Packaging Information table.

These full reels are individually barcode labeled and

placed inside a standard intermediate box (illustrated in

figure 1.0) made of recyclable corrugated brown paper.

One box contains two reels maximum. And these boxes

are placed inside a barcode labeled shipping box which

comes in different sizes depending on the number of parts

shipped.

852

NDS

9959

852

NDS

9959

852

NDS

9959

SO-8 Tape and Reel Data and Package Dimensions

July 1999, Rev. B

P1-P3 P4-P6 P7-P9 P10-P12

NDS8852H

Mfr. #:

Buy NDS8852H

Manufacturer:

ON Semiconductor / Fairchild

Description:

MOSFET DISC BY MFG 2/02

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

T/T Paypal Visa MoneyGram Western Union

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NDS8852H