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L6205
THERMAL DATA
PIN CONNECTIONS (Top View)
(5) The slug is internally connected to pins 1,10,11 and 20 (GND pins).
Symbol Description PowerDIP20 SO20 PowerSO20 Unit
R
th-j-pins
MaximumThermal Resistance Junction-Pins 12 14 - °C/W
R
th-j-case
Maximum Thermal Resistance Junction-Case - - 1 °C/W
R
th-j-amb1
MaximumThermal Resistance Junction-Ambient
1
(1) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the bottom side of 6cm
2
(with a thickness of 35µm).
40 51 - °C/W
R
th-j-amb1
Maximum Thermal Resistance Junction-Ambient
2
(2) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6cm
2
(with a thickness of 35µm).
--35°C/W
R
th-j-amb1
MaximumThermal Resistance Junction-Ambient
3
(3) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6cm
2
(with a thickness of 35µm), 16 via holes
and a ground layer.
--15°C/W
R
th-j-amb2
Maximum Thermal Resistance Junction-Ambient
4
(4) Mounted on a multi-layer FR4 PCB without any heat sinking surface on the board.
56 77 62 °C/W
PowerDIP20/SO20
PowerSO20
(5)
GND
OUT1
A
SENSE
A
IN2
A
IN1
A
VCP
EN
A
OUT2
A
VS
A
VS
B
OUT2
B
VBOOT
IN2
B
EN
B
IN1
B
SENSE
B
OUT1
B
GND10
8
9
7
6
5
4
3
2
13
14
15
16
17
19
18
20
12
1
11
GND GND
D99IN1092A
GND
OUT1
B
SENSE
B
IN1
B
IN2
B
1
3
2
4
5
6
7
8
9
EN
B
VBOOT
OUT2
B
VS
B
GND15
14
13
12
11
D99IN1093A
10
20
19
18
17
16
IN1
A
IN2
A
SENSE
A
OUT1
A
GND GND
VS
A
OUT2
A
VCP
EN
A