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L6205D

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
L6205
16/21
Figure 17. Mounting the PowerSO package.
Figure 18. PowerSO20 Junction-Ambient thermal resistance versus on-board copper area.
Figure 19. PowerDIP20 Junction-Ambient thermal resistance versus on-board copper area.
Figure 20. SO20 Junction-Ambient thermal resistance versus on-board copper area.
Slug soldered
to PCB with
dissipating area
Slug soldered
to PCB with
dissipating area
plus ground layer
Slug soldered to PCB with
dissipating area plus ground layer
contacted through via holes
13
18
23
28
33
38
43
12345678910111213
Without Ground Layer
With Ground Layer
With Ground Layer+16 via
Holes
sq. cm
ºC / W
On-Board Copper Area
sq. cm
ºC / W
On-Board Copper Area
Copper Area is on Bottom Side
Copper Area is on Top Side
33
34
35
36
37
38
39
40
41
42
123456789101112
48
50
52
54
56
58
60
62
64
66
68
123456789101112
Copper Area is on Top Side
sq. cm
ºC / W
On-Board Copper Area
17/21
L6205
Figure 21. Typical Quiescent Current vs.
Supply Voltage
Figure 22. Normalized Typical Quiescent
Current vs. Switching Frequency
Figure 23. Typical Low-Side R
DS(ON)
vs.
Supply Voltage
Figure 24. Typical High-Side RDS(ON) vs.
Supply Voltage
Figure 25. Normalized R
DS(ON)
vs.Junction
Temperature (typical value)
Figure 26. Typical Drain-Source Diode
Forward ON Characteristic
4.6
4.8
5.0
5.2
5.4
5.6
0 102030405060
Iq [mA]
V
S
[V]
f
sw
= 1kHz T
j
= 25°C
T
j
= 85°C
T
j
= 125°C
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
0 20406080100
Iq / (Iq @ 1 kHz)
f
SW
[kHz]
0.276
0.280
0.284
0.288
0.292
0.296
0.300
0 5 10 15 20 25 30
R
DS(ON)
[
Ω
]
V
S
[V]
T
j
= 25°C
0.336
0.340
0.344
0.348
0.352
0.356
0.360
0.364
0.368
0.372
0.376
0.380
0 5 10 15 20 25 30
R
DS(ON)
[
Ω
]
V
S
[V]
T
j
= 25°C
0.8
1.0
1.2
1.4
1.6
1.8
0 20406080100120140
R
DS(ON)
/ (R
DS(ON)
@ 25 °C)
Tj [°C]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
700 800 900 1000 1100 1200 1300
I
SD
[A]
V
SD
[mV]
T
j
= 25°C
L6205
18/21
OUTLINE AND
MECHANICAL DATA
e
a2
A
E
a1
PSO20MEC
DETAIL A
T
D
110
1120
E1
E2
h x 45
DETAIL A
lead
slug
a3
S
Gage Plane
0.35
L
DETAIL B
R
DETAIL B
(COPLANARITY)
GC
- C -
SEATING PLANE
e3
b
c
NN
H
BOTTOM VIEW
E3
D1
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 3.6 0.142
a1 0.1 0.3 0.004 0.012
a2 3.3 0.130
a3 0 0.1 0.000 0.004
b 0.4 0.53 0.016 0.021
c 0.23 0.32 0.009 0.013
D (1) 15.8 16 0.622 0.630
D1 9.4 9.8 0.370 0.386
E 13.9 14.5 0.547 0.570
e 1.27 0.050
e3 11.43 0.450
E1 (1) 10.9 11.1 0.429 0.437
E2 2.9 0.114
E3 5.8 6.2 0.228 0.244
G 0 0.1 0.000 0.004
H 15.5 15.9 0.610 0.626
h 1.1 0.043
L 0.8 1.1 0.031 0.043
N 8˚ (typ.)
S 8˚ (max.)
T 10 0.394
(1) “D and E1” do not include mold flash or protusions.
- Mold flash or protusions shall not exceed 0.15mm (0.006”)
- Critical dimensions: “E”, “G” and “a3”.
PowerSO20
0056635
JEDEC MO-166
Weight:
1.9gr
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21

L6205D

Mfr. #:
Buy L6205D
Manufacturer:
STMicroelectronics
Description:
Motor / Motion / Ignition Controllers & Drivers Dual Full Bridge
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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