KAF−8300
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MECHANICAL INFORMATION
Visual Mechanical Specifications
Table 16. LASER MARK
Item Description
Device Name KAF−8300CE, KAF−8300XE, KAF−8300−AXC (Multiple versions available).
See Ordering Information section of this document.
Serial Number nnn −a numeric field containing a maximum of three characters denoting a unique unit identifier for a device
from the before mentioned production lot. The start of the sequence starts with “1”. “001” is not a valid
marking.
NOTE: All markings shall be readable, consistent in size with no unusual debris left on the package.
Table 17. ASSEMBLY/PACKAGE INTEGRITY
Criteria Description
Cracks None allowed.
Corner and Edge
Chip-Outs
None − exceeding 0.020″ (0.50 mm).
Chip-Outs Exposing
Buried Metal Traces
None allowed.
Chip-Outs, Other None allowed deeper than 50% of the ceramic layer thickness in which it resides.
Scratches None − that exceed 0.020″ (0.50 mm) in the major dimension and are deeper than 50% of the ceramic layer
thickness in which it resides.
Lead Conditions No bent, missing, damaged, or short leads. No lead cut-off burrs exceeding 0.005″ (0.13 mm) in the
dimension away from the lead.
Internal Appearance
and Die Condition
Local Non-Uniformity: Local Non-Uniformity region (LNU) is allowed whose size is not greater than 200 mm
2
within the effective image area. Inspection equipment for these steps are performed using a microscope
7−50X and direct lighting (ring-light). LNU is described as a spot or streak that tends to change from light to
dark in appearance as the operator rotates the part under angled lighting conditions. These non-uniformities
are not visible or very hard to see under direct lighting. They tend to disappear or become much less visible
under higher magnification.
Conditions Other than LNU: No scratches, digs, contamination, marks, or blemishes that is attached to the
die that touches 9 or more pixels in the effective image area. No loose contamination allowed when viewed
at 7X and 50X magnification. No scratches, digs, contamination, marks, or blemishes greater than 10 mm are
allowed on the bottom side of the cover glass region that is contained in or extends into the effective image
area. Tools used to verify are 7X and 50X magnification.
Table 18. GLASS
Criteria Description
Tilt The reject condition is when the glass is incorrectly seated on the package or is not parallel to glass seal
area. (“parallel” is defined as 0.25 mm maximum end to end).
Seal Glass seal must be greater than 50% of the width of the epoxy bond line and must not extend over the
ceramic package.
Alignment There are 4 “+” fiducials on the corners the die that must not be covered by the epoxy light shield.
The 4 “+” marks must be in total view when the lid is placed looking directly down on the device with
a microscope. All 4 “+” alignment marks are required to be visible in their entirety with a zero clearance
tolerance.
Chips None allowed.
Appearance No fogged cover allowed.
Contamination No immobile scratches, digs, contamination, marks, or blemishes are allowed on the cover glass region that
is contained in or extends into the effective image area. Within the effective image area, the limit for such
conditions is 10 mm or less. This criterion pertains to either the top or the bottom glass surface. Tools used to
verify are 7X and 50X magnification.
