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Figure 3. Block Diagram (Monochrome)
248 pixels
Last Hccd Phase: H1
3326 Active Pixels (typical active line format)
Last Vccd Phase: V2
20 Active Buffer
8 Dark Dummy
39 Dark
6 Dark Dummy
3 Dummy
1 Active (CTE Monitor)
H1
H2
20 Active Buffer
5 Dark Dummy
5 Dummy
1 Active (CTE Monitor)
8 Dummy
4 Virtual Dummy Column
2 Dummy
OG
SUB
VOUT
RG
RD
H1L
VDD
VSS
V1
V2
1 Active (CTE Monitor)
20 Active Buffer
3 Dark Dummy
LODT
LODB
20 Active Buffer
8 Dark Dummy
12 Dark
6 Dark Dummy
2504 Active Lines/Frame
Active Image Area 3326 (H) X 2504 (V)
Effective Image Area 3366 (H) X 2544 (V)
5.4 microns X 5.4 microns
4:3 Aspect Ratio
1163 pixels 1162 pixels
Dark Reference Pixels
Surrounding the periphery of the device is a border of light
shielded pixels creating a dark region. Within this dark
region there are light shielded pixels that include 39 trailing
dark pixels on every line. There are also 12 full dark lines at
the start of every frame. Under normal circumstances, these
pixels do not respond to light and may be used as a dark
reference.
Dark Dummy Pixels
Within the dark region some pixels are in close proximity
to an active pixel, or the light sensitive regions that have
been added for manufacturing test purposes, (CTE
Monitor). In both cases, these pixels can scavenge signal
depending on light intensity and wavelength. These pixels
should not be used as a dark reference. These pixels are
called dark dummy pixels.
Within the dark region, dark dummy pixels have been
identified. There are 5 leading and 14 (6 + 8) trailing dark
pixels on every line. There are also 14 (6 + 8) dark dummy
lines at the start of every frame along with 3 dark dummy
lines at the end of each frame.
Dummy Pixels
Within the horizontal shift register there are 13, (8 + 5),
leading and 5, (2 + 3), trailing additional shift phases that are
not electrically associated with any columns of pixels within
the vertical register. These pixels contain only horizontal
shift register dark current signal and do not respond to light
and therefore, have been designated as dummy pixels. For
this reason, they should not be used to determine a dark
reference level.
Virtual Dummy Columns
Within the horizontal shift register there is 4 leading shift
phases that are not physically associated with a column of
pixels within the vertical register. These pixels contain only
horizontal shift register dark current signal and do not
respond to light and therefore, have been designated as
virtual dummy columns. For this reason, they also should
not be used to determine a dark reference level.
Active Buffer Pixels
For color devices, sixteen buffer pixels adjacent to the
blue pixel buffer region contain a RGB mosaic color pattern.
This region is classified as active buffer pixels. These pixels
are light sensitive but they are not tested for defects and
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non-uniformities. The response of these pixels will not be
uniform.
For monochrome devices, 20 buffer pixels adjacent to the
dark dummy pixels are classified as active buffer pixels.
These pixels are light sensitive but they are not tested for
defects and non-uniformities. The response of these pixels
will not be uniform.
Blue Pixel Buffer
For color devices, four buffer pixels adjacent to any
leading or trailing dark reference regions contain a blue filter
and is classified as a blue pixel buffer. These pixels are light
sensitive but they are not tested for defects and
non-uniformities. The response of these pixels will not be
uniform.
Monochrome devices do not contain a blue pixel buffer.
CTE Monitor Pixels
Within the horizontal dummy pixel region two light
sensitive test pixels (one each on the leading and trailing
ends) are added and within the vertical dummy pixel region
one light sensitive test pixel has been added. These CTE
monitor pixels are used for manufacturing test purposes. In
order to facilitate measuring the device CTE, the pixels in
the CTE Monitor region in the horizontal and vertical
portion is coated with blue pigment on the color version
only. The monochrome device is uncoated).
Image Acquisition
An electronic representation of an image is formed when
incident photons falling on the sensor plane create
electron-hole pairs within the device. These photon-induced
electrons are collected locally by the formation of potential
wells at each photogate or pixel site. The number of
electrons collected is linearly dependent on light level and
exposure time and non-linearly dependent on wavelength.
When the pixel’s capacity is reached, excess electrons are
discharged into the lateral overflow drain to prevent
crosstalk or ‘blooming’. During the integration period, the
V1 and V2 register clocks are held at a constant (low) level.
Charge Transport
The integrated charge from each photogate is transported
to the output using a two-step process. Each line (row) of
charge is first transported from the vertical CCD’s to
a horizontal CCD register using the V1 and V2 register
clocks. The horizontal CCD is presented a new line on the
falling edge of V2 while H1 is held high. The horizontal
CCD’s then transport each line, pixel by pixel, to the output
structure by alternately clocking the H1 and H2 pins in
a complementary fashion. A separate connection to the last
H1 phase (H1L) is provided to improve the transfer speed of
charge to the floating diffusion. On each falling edge of H1
a new charge packet is dumped onto a floating diffusion and
sensed by the output amplifier.
Horizontal Register
Output Structure
Charge presented to the floating diffusion (FD) is
converted into a voltage and is current amplified in order to
drive off-chip loads. The resulting voltage change seen at the
output is linearly related to the amount of charge placed on
the FD. Once the signal has been sampled by the system
electronics, the reset gate (RG) is clocked to remove the
signal and FD is reset to the potential applied by reset drain
(RD). Increased signal at the floating diffusion reduces the
voltage seen at the output pin. To activate the output
structure, an off-chip load must be added to the VOUT pin
of the device. See Figure 5.
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Figure 4. Output Architecture (Left of Right)
HCCD
Charge
Transfer
Source
Follower
#1
Source
Follower
#2
Source
Follower
#3
Floating
Diffusion
H2
VDD
VOUT
H1
H1L
OG
RG
RD
VSS
Output Load
Figure 5. Recommended Output Structure Load Diagram
Buffered Video Output
2N3904 or Equivalent
0.1 mF
680 W
130 W
V
OUT
V
DD
= 15 V
I
OUT
= | 5.4 mA |
NOTE: Component values may be revised based on operating conditions and other design considerations.

KAF-8300-CXB-CB-AA-OFFSET

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Image Sensors FULL FRAME CCD IMAGE SENSOR
Lifecycle:
New from this manufacturer.
Delivery:
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