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VND1NV04-E

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33
Package and PCB thermal data VND1NV04 - VNN1NV04 - VNS1NV04
22/33 Doc ID 7381 Rev 4
4.3 SO-8 thermal data
Figure 38. SO-8 PC board
1. Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm,PCB thickness = 2 mm,
Cu thickness=35 µm , Copper areas: from minimum pad layout to 2 cm
2
).
Figure 39. SO-8 R
thj-amb
vs. PCB copper area in open box free air condition
.
65
75
85
95
105
00,511,522,5
PCB Cu heatsink area (cm^2) - (refer to PCB layout)
footprint
VND1NV04 - VNN1NV04 - VNS1NV04 Package and PCB thermal data
Doc ID 7381 Rev 4 23/33
Figure 40. SO-8 thermal impedance junction ambient single pulse
Equation 3: Pulse calculation formula
where δ = t
P
/T
Figure 41. SO-8 thermal fitting model of a single channel
ZTH (°C/ W)
0,1
1
10
100
1000
0,0001 0,001 0,01 0,1 1 10 100 1000
Time (s)
Footprint
2 cm
2
Z
THδ
R
TH
δ Z
THtp
1 δ–()+⋅=
Package and PCB thermal data VND1NV04 - VNN1NV04 - VNS1NV04
24/33 Doc ID 7381 Rev 4
Table 7. SO-8 thermal parameter
Area/island (cm
2
)FP2
R1 (°C/W) 0.8
R2 (°C/W) 2.6
R3 (°C/W) 3.5
R4 (°C/W) 21
R5 (°C/W) 16
R6 (°C/W) 58 28
C1 (W·s/°C) 0.00006
C2 (W·s/°C) 0.0005
C3 (W·s/°C) 0.0075
C4 (W·s/°C) 0.045
C5 (W·s/°C) 0.35
C6 (W·s/°C) 1.05 2
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33

VND1NV04-E

Mfr. #:
Buy VND1NV04-E
Manufacturer:
STMicroelectronics
Description:
Gate Drivers OMNIFETII FULLY AUTO PROTECT Pwr MOSFET
Lifecycle:
New from this manufacturer.
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