22
32142DS–06/2013
ATUC64/128/256L3/4U
4.2 Package Drawings
Figure 4-1. TQFP-48 Package Drawing
Table 4-2. Device and Package Maximum Weight
140 mg
Table 4-3. Package Characteristics
Moisture Sensitivity Level MSL3
Table 4-4. Package Reference
JEDEC Drawing Reference MS-026
JESD97 Classification E3
23
32142DS–06/2013
ATUC64/128/256L3/4U
Figure 4-2. QFN-48 Package Drawing
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 4-5. Device and Package Maximum Weight
140 mg
Table 4-6. Package Characteristics
Moisture Sensitivity Level MSL3
Table 4-7. Package Reference
JEDEC Drawing Reference M0-220
JESD97 Classification E3
24
32142DS–06/2013
ATUC64/128/256L3/4U
Figure 4-3. TLLGA-48 Package Drawing
Table 4-8. Device and Package Maximum Weight
39.3 mg
Table 4-9. Package Characteristics
Moisture Sensitivity Level MSL3
Table 4-10. Package Reference
JEDEC Drawing Reference N/A
JESD97 Classification E4

ATUC256L3U-Z3UT

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
32-bit Microcontrollers - MCU UC3L-256KB Flash 64QFN 85C green TRAY
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet