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ATUC256L3U-Z3UT

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45
25
32142DS–06/2013
ATUC64/128/256L3/4U
Figure 4-4. TQFP-64 Package Drawing
Table 4-11. Device and Package Maximum Weight
300 mg
Table 4-12. Package Characteristics
Moisture Sensitivity Level MSL3
Table 4-13. Package Reference
JEDEC Drawing Reference MS-026
JESD97 Classification E3
26
32142DS–06/2013
ATUC64/128/256L3/4U
Figure 4-5. QFN-64 Package Drawing
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 4-14. Device and Package Maximum Weight
200 mg
Table 4-15. Package Characteristics
Moisture Sensitivity Level MSL3
Table 4-16. Package Reference
JEDEC Drawing Reference M0-220
JESD97 Classification E3
27
32142DS–06/2013
ATUC64/128/256L3/4U
4.3 Soldering Profile
Table 4-17 gives the recommended soldering profile from J-STD-20.
A maximum of three reflow passes is allowed per component.
Table 4-17. Soldering Profile
Profile Feature Green Package
Average Ramp-up Rate (217°C to Peak) 3°C/s max
Preheat Temperature 175°C ±25°C 150-200°C
Time Maintained Above 217°C 60-150 s
Time within 5C of Actual Peak Temperature 30 s
Peak Temperature Range 260°C
Ramp-down Rate 6°C/s max
Time 25C to Peak Temperature 8 minutes max
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45

ATUC256L3U-Z3UT

Mfr. #:
Buy ATUC256L3U-Z3UT
Manufacturer:
Microchip Technology / Atmel
Description:
32-bit Microcontrollers - MCU UC3L-256KB Flash 64QFN 85C green TRAY
Lifecycle:
New from this manufacturer.
Delivery:
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