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AT25HP512C1-10CI-1.8

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
16
AT25HP256/512
1113L–SEEPR–3/06
Packaging Information
8CN1 – LAP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8CN1, 8-lead (8 x 5 x 1.04 mm Body), Lead Pitch 1.27 mm,
Leadless Array Package (LAP)
A
8CN1
11/13/01
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.94 1.04 1.14
A1 0.30 0.34 0.38
b 0.36 0.41 0.46 1
D 7.90 8.00 8.10
E 4.90 5.00 5.10
e 1.27 BSC
e1 0.60 REF
L 0.62 .0.67 0.72 1
L1 0.92 0.97 1.02 1
Note: 1. Metal Pad Dimensions.
Pin1 Corner
Marked Pin1 Indentifier
0.10 mm
TYP
4
3
2
1
5
6
7
8
Top View
L
b
e
L1
e1
Side View
A1
A
Bottom View
E
D
17
AT25HP256/512
1113L–SEEPR–3/06
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicu
lar to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
A
–
–
0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005
–
–
3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2
Top View
Side View
End View
18
AT25HP256/512
1113L–SEEPR–3/06
16S2 – JEDEC SOIC
2325 Orchard Parkwa
y
San Jose
,
CA 9513
1
TITLE
DRAWIN
G
N
O.
R
REV.
1
6S2
, 16-lead, 0.300" Wide Bod
y
, Plastic Gul
l
Wing Small Outline Package (SOIC)
1
/9/02
16S2 A
CO
MM
O
N DIMEN
S
I
O
N
S
(
Unit of Measure = inches
)
SYMBOL
MIN
NOM
MAX
NOTE
Not
es
:
1.
This drawin
g
is for
g
eneral information only; refer to JEDEC drawin
g
MS-013, Variation AA, for additional information
.
2.
Dimension D does not include mold Flash, protrusions or
g
ate burrs. Mold Flash, protrusions and
g
ate burrs shall not exceed
3
. Dimension E does not include inter-lead Flash or
p
rotrusion. Inter-lead Flash and
p
rotrusions shall not exceed 0.25 mm
4.
5
. The lead width B, as measured 0.36 mm (0.014") or
g
reater above the seatin
g
plane, shall not exceed a maximum value of 0.61 mm
(
0.024"
)
p
er side
.
A 0.0926 – 0.1043
A1 0.0040 – 0.0118
b 0.0130 – 0.0200 5
C 0.0091 – 0.0125
D 0.3977 – 0.4133 2
E 0.2914 – 0.2992 3
H 0.3940 – 0.4190
L 0.0160 – 0.050 4
e 0.050 BSC
L
A1
S
ide Vie
w
To
p
Vie
w
En
d
Vi
ew
H
E
b
N
1
e
A
D
C
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21

AT25HP512C1-10CI-1.8

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Buy AT25HP512C1-10CI-1.8
Manufacturer:
Description:
IC EEPROM 512K SPI 10MHZ 8LAP
Lifecycle:
New from this manufacturer.
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