OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

MT46H64M32L2JG-6 IT:A

P1-P3P4-P6P7-P9P10-P12
PDF: 09005aef833508fb/Source: 09005aef83350d72 Micron Technology, Inc., reserves the right to change products or specifications without notice.
ddr_mobile_sdram_only_168b_pop.fm - Rev. B 01/09 EN
10 ©2008 Micron Technology, Inc. All rights reserved.
168-Ball x16, x32 Mobile LPDDR PoP (TI OMAP)Mobile DDR
SDRAM Addendum
Preliminary
Device Diagram
Figure 6: 168-Ball VFBGA Functional Block Diagram
CS#
CK
CK#
CKE
RAS#
CAS#
WE#
Address,
BA0, BA1
Vdd
Vddq
DM
DQ
DQS
TQ
Vss
Vssq
LPDDR
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
www.micron.com/productsupport Customer Comment Line: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
Preliminary: This data sheet contains initial characterization limits that are subject to change upon full characterization of production
devices.
168-Ball x16, x32 Mobile LPDDR PoP (TI OMAP)Mobile DDR
SDRAM Addendum
PDF: 09005aef833508fb/Source: 09005aef83350d72 Micron Technology, Inc., reserves the right to change products or specifications without notice.
ddr_mobile_sdram_only_168b_pop.fm - Rev. B 01/09 EN
11 ©2008 Micron Technology, Inc. All rights reserved.
Preliminary
Package Dimensions
Figure 7: 168-Ball VFBGA
Notes: 1. All dimensions are in millimeters.
0.6 ±0.05
0.08
A
A
Mold compound: epoxy novolac
Solder ball material:
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Substrate material:
plastic laminate with OSP finish
5.5
11
Ball A1 ID
Ball A1 ID
0.5
TYP
6 ±0.08
5.5
12 ±0.15
11
Seating
plane
12 ±0.15
6 ±0.08
168X Ø0.326
0.5 TYP
Dimensions apply
to solder balls post-
reflow. Pre-reflow
ball is Ø0.3 on Ø0.27
SMD ball pads.
0.9 MAX
23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
PDF: 09005aef833508fb/Source: 09005aef83350d72 Micron Technology, Inc., reserves the right to change products or specifications without notice.
ddr_mobile_sdram_only_168b_pop.fm - Rev. B 01/09 EN
12 ©2008 Micron Technology, Inc. All rights reserved.
168-Ball x16, x32 Mobile LPDDR PoP (TI OMAP)Mobile DDR
SDRAM Addendum
Preliminary
Revision History
Rev. B, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1/09
• “Mobile LPDDR” on page 1: Changed title from “LPDDR-SDRAM” to “Mobile
LPDDR.”
• “General Description” on page 3: Deleted “SDRAM” from description.
• Table 4, “Non-Device-Specific Ball Descriptions,” on page 8: Removed V2 from Vss
x16 and x32 balls; divided table into shared balls and miscellaneous balls.
Rev. A, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11/08
•Initial release.
P1-P3P4-P6P7-P9P10-P12

MT46H64M32L2JG-6 IT:A

Mfr. #:
Buy MT46H64M32L2JG-6 IT:A
Manufacturer:
Micron
Description:
IC DRAM 2G PARALLEL 168VFBGA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet