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LTC4257CDD-1#TRPBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
LTC4257-1
19
42571fb
U
PACKAGE DESCRIPTIO
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
.050 BSC
.030 ±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 1203
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
LTC4257-1
20
42571fb
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2003
LT 1205 1K REV B • PRINTED IN USA
PD Power Interface with 3.3V, 3A Nonisolated Power Supply
TYPICAL APPLICATIO
U
1
3
2
RX
–
6
RX
+
3
TX
–
2
TX
+
J1
T1
XFMR
RJ45
1
7
8
5
4
SPARE
–
SPARE
+
6
8
7
TXOUT
+
TXOUT
–
RXOUT
+
RXOUT
–
TO
PHY
R12
75Ω
R11
75Ω
75Ω
C4
0.01µF
200V
C3
0.01µF
200V
0.01µF
200V
0.01µF
200V
C8
0.001µF
2kV
16
14
15
11
9
10
C14
0.1µF
100V
LTC4257-1
LTC1871
Q3
FDC2512
C1A
4.7µF
100V
Q2
FMMT625
D3
TVS
SMAJ58A
D4
MMBZ5235B
6.8V
R
CLASS
1%
NC
R
CLASS
NC
V
IN
GND
SIGDISA
PWRGD
V
OUT
RUN
I
TH
FB
FREQ
MODE/SYNC
SENSE
V
IN
INTV
CC
GATE
GND
BR2
DF01SA
~+
~–
BR1
DF01SA
~+
~–
C1B
2.2µF
100V
R10
100k
R
T
80.6k
1%
R14
12.4k
1%
R15
21k 1%
C6
1µF 6.3V
Q1
2N7002
C
C1
1nF
R
C
12k
R17
750Ω
R13
100k
L1
1µH
R16
100Ω
Q4
FMMT2222
D6
1N4148
R9
100k
R18
10k
+
NOTES: UNLESS OTHERWISE SPECIFIED
1. ALL RESISTOR VALUES ARE 5%
2. SELECT R
CLASS
FOR CLASS 1-4 OPERATION.
REFER TO DATA SHEET APPLICATIONS INFORMATION SECTION
3. CONNECT TO CHASSIS GROUND
C1A: PANASONIC ECEV2AA4R7P
C1B: TDK C5750X7R2A225KT
C8: AVX 1808GC102MAT
C9, C10, C12, C13: TDK C4532X5ROJ107
L1: LQLB2518T1ROM
T1: PULSE H2019
R5
0.1Ω
1%
C5
4.7µF
6.3V
•
4
2
11
9
T2
CTX-02-15242
D5
UPS840
12
4257 TA03
10
••
C9
100µF
X5R
6.3V
C10
100µF
X5R
6.3V
V
OUT
+
3.3V
AT 3A
V
OUT
–
+
+
C12
100µF
X5R
6.3V
C13
100µF
X5R
6.3V
+
+
3
2
75Ω
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Burst Mode is a registered trademark of Linear Technology Corporation. No R
SENSE
and ThinSOT are trademarks of Linear Technology Corporation.
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LTC4257CDD-1#TRPBF

Mfr. #:
Buy LTC4257CDD-1#TRPBF
Manufacturer:
Analog Devices Inc.
Description:
Power Switch ICs - POE / LAN IEEE 802.3af PD Pwr over E Int Cntr w/ 2
Lifecycle:
New from this manufacturer.
Delivery:
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