OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

74LVC823ABQ,115

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22
74LVC823A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 4 — 8 April 2013 15 of 21
NXP Semiconductors
74LVC823A
9-bit D-type flip-flop; 5 V tolerance; positive edge-trigger; 3-state
Fig 13. Package outline SOT340-1 (SSOP24)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
0.65 1.25
7.9
7.6
0.9
0.7
0.8
0.4
8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT340-1 MO-150
99-12-27
03-02-19
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
112
24 13
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
A
max.
2
74LVC823A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 4 — 8 April 2013 16 of 21
NXP Semiconductors
74LVC823A
9-bit D-type flip-flop; 5 V tolerance; positive edge-trigger; 3-state
Fig 14. Package outline SOT355-1 (TSSOP24)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
0.4
0.3
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT355-1 MO-153
99-12-27
03-02-19
0.25
0.5
0.2
w M
b
p
Z
e
112
24
13
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
D
y
0 2.5 5 mm
scale
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
A
max.
1.1
74LVC823A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 4 — 8 April 2013 17 of 21
NXP Semiconductors
74LVC823A
9-bit D-type flip-flop; 5 V tolerance; positive edge-trigger; 3-state
Fig 15. Package outline SOT815-1 (DHVQFN24)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
SOT815-1 - - - - - - - - -
03-04-29
SOT815-1
0 2.5 5 mm
scale
b
y
y
1
C
C
AC
C
B
v
M
w
M
e
1
e
2
terminal 1
index area
terminal 1
index area
X
UNIT
A
(1)
max.
A
1
bc eE
h
Le
1
ywv
mm
1
0.05
0.00
0.30
0.18
0.5 4.5
e
2
1.50.2
2.25
1.95
D
h
4.25
3.95
0.05 0.05
y
1
0.10.1
DIMENSIONS (mm are the original dimensions)
0.5
0.3
D
(1)
5.6
5.4
E
(1)
3.6
3.4
D
E
B
A
e
DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm
A
A
1
c
detail X
E
h
L
D
h
2
23
11
14
13
12
1
24
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22

74LVC823ABQ,115

Mfr. #:
Buy 74LVC823ABQ,115
Manufacturer:
Nexperia
Description:
IC FF D-TYPE SNGL 9BIT 24DHVQFN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet