4
IDT72V3612 3.3V, CMOS SyncBiFIFO
TM
64 x 36 x 2 COMMERCIAL TEMPERATURE RANGE
PIN DESCRIPTION (CONTINUED)
Symbol Name I/O Description
MBF2 Mail2 Register Flag O MBF2 is set LOW by a LOW-to-HIGH transition of CLKB that writes data to the mail2 register.
Writes to the mail2 register are inhibited while MBF2 is set LOW. MBF2 is set HIGH by a LOW-to-
HIGH transition of CLKA when a port A read is selected and MBA is HIGH. MBF2 is set HIGH
when the device is reset.
ODD/ Odd/Even Parity I Odd parity is checked on each port when ODD/EVEN is HIGH, and even parity is checked when
EVEN Select ODD/EVEN is LOW. ODD/EVEN also selects the type of parity generated for each port if parity
generation is enabled for a read operation.
PEFA Port A Parity Error O When any byte applied to terminals A0-A35 fails parity, PEFA is LOW. Bytes are organized as
Flag (Port A) A0-A8, A9-A17, A18-A26, and A27-A35, with the most significant bit of each byte serving as the
parity bit. The type of parity checked is determined by the state of the ODD/EVEN input. The
parity trees used to check the A0-A35 inputs are shared by the mail2 register to generate parity if
parity generation is selected by PGA. Therefore, if a mail2 read with parity generation is setup by
having W/RA LOW, MBA HIGH, and PGA HIGH, the PEFA flag is forced HIGH regardless of the
A0-A35 inputs.
PEFB Port B Parity Error O When any byte applied to terminals B0-B35 fails parity, PEFB is LOW. Bytes are organized as
Flag (Port B) B0-B8, B9-B17, B18-B26, B27-B35 with the most significant bit of each byte serving as the parity
bit. The type of parity checked is determined by the state of the ODD/EVEN input. The parity trees
used to check the B0-B35 inputs are shared by the mail1 register to generate parity if parity
generation is selected by PGB. Therefore, if a mail1 read with parity generation is setup by having
W/RB LOW, MBB HIGH, and PGB HIGH, the PEFB flag is forced HIGH regardless of the state of
the B0-B35 inputs.
PGA Port A Parity I Parity is generated for data reads from port A when PGA is HIGH. The type of parity generated is
Generation selected by the state of the ODD/EVEN input. Bytes are organized as A0-A8, A9-A17, A18-A26,
and A27-A35. The generated parity bits are output in the most significant bit of each byte.
PGB Port B Parity I Parity is generated for data reads from port B when PGB is HIGH. The type of parity generated is
Generation selected by the state of the ODD/EVEN input. Bytes are organized as B0-B8, B9-B17, B18-B26,
and B27-B35. The generated parity bits are output in the most significant bit of each byte.
RST Reset I To reset the device, four LOW-to-HIGH transitions of CLKA and four LOW-to-HIGH transitions of
CLKB must occur while RST is LOW. This sets the AFA, AFB, MBF1, and MBF2 flags HIGH and
the EFA, EFB, AEA, AEB, FFA, and FFB flags LOW. The LOW-to-HIGH transition of RST latches
the status of the FS1 and FS0 inputs to select Almost-Full and Almost-Empty flag offset.
W/RA Port A Write/Read I A HIGH selects a write operation and a LOW selects a read operation on port A for a LOW-to-
Select HIGH transition of CLKA. The A0-A35 outputs are in the high-impedance state when W/RA is
HIGH.
W/RB Port B Write/Read I A HIGH selects a write operation and a LOW selects a read operation on port B for a LOW-to-
Select HIGH transition of CLKB. The B0-B35 outputs are in the high-impedance state when W/RB is
HIGH.
5
IDT72V3612 3.3V, CMOS SyncBiFIFO
TM
64 x 36 x 2 COMMERCIAL TEMPERATURE RANGE
ABSOLUTE MAXIMUM RATINGS OVER OPERATING FREE-AIR
TEMPERATURE RANGE (Unless otherwise noted)
(2)
Symbol Rating Commercial Unit
V
CC Supply Voltage Range –0.5 to +4.6 V
V
I
(2)
Input Voltage Range –0.5 to VCC+0.5 V
VO
(2)
Output Voltage Range –0.5 to VCC+0.5 V
IIK Input Clamp Current, (VI < 0 or VI > VCC) ±20 mA
I
OK Output Clamp Current, (VO < 0 or VO > VCC) ±50 mA
I
OUT Continuous Output Current, (VO = 0 to VCC) ±50 mA
ICC Continuous Current Through VCC or GND ±500 mA
T
STG Storage Temperature Range –65 to 150
°
C
NOTES:
1. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at
these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended
periods may affect device reliability.
2. The input and output voltage ratings may be exceeded provided the input and output current ratings are observed.
ELECTRICAL CHARACTERISTICS OVER RECOMMENDED OPERATING FREE-
AIR TEMPERATURE RANGE (Unless otherwise noted)
NOTES:
1. All typical values are at VCC = 3.3V, TA = 25
°
C.
2. For additional ICC information, see Figure 1, Typical Characteristics: Supply Current (ICC) vs. Clock Frequency (fS).
Symbol Parameter Min. Typ. Max. Unit
V
CC
(1)
Supply Voltage 3.0 3.3 3.6 V
V
IH HIGH Level Input Voltage 2 VCC+0.5 V
VIL LOW-Level Input Voltage 0.8 V
I
OH HIGH-Level Output Current 4 mA
IOL LOW-Level Output Current 8 mA
TA Operating Free-air 0 70
°
C
Temperature
RECOMMENDED OPERATING
CONDITIONS
IDT72V3612
Commercial
tCLK = 12, 15 ns
Symbol Parameter Test Conditions Min.
Typ.
(1)
Max. Unit
VOH Output Logic "1" Voltage VCC = 3.0V, IOH = –4 mA 2.4 V
VOL Output Logic "0" Voltage VCC = 3.0V, IOL = 8 mA 0.5 V
ILI Input Leakage Current (Any Input) VCC = 3.6V, VI = VCC or 0 ±5 μA
ILO Output Leakage Current VCC = 3.6V, VO = VCC or 0 ±5 μA
ICC
(2)
Standby Current VCC = 3.6V, VI = VCC - 0.2V or 0 500 μA
CIN Input Capacitance VI = 0, f = 1 MHz 4 pF
COUT Output Capacitance VO = 0, f = 1 MHZ 8 pF
NOTE:
1. For 12ns (83MHz operation), Vcc=3.3V +/-0.15V, JEDEC JESD8-A compliant
6
IDT72V3612 3.3V, CMOS SyncBiFIFO
TM
64 x 36 x 2 COMMERCIAL TEMPERATURE RANGE
DETERMINING ACTIVE CURRENT CONSUMPTION AND POWER DISSIPATION
The I
CC(f)
current for the graph in Figure 1 was taken while simultaneously reading and writing the FIFO on the IDT72V3612 with CLKA and CLKB set to
f
S
. All data inputs and data outputs change state during each clock cycle to consume the highest supply current. Data outputs were disconnected to normalize
the graph to a zero-capacitance load. Once the capacitance load per data-output channel is known, the power dissipation can be calculated with the equation
below.
CALCULATING POWER DISSIPATION
With ICC(f) taken from Figure 1, the maximum power dissipation (PT) of the IDT72V3612 may be calculated by:
PT = VCC x ICC(f) + Σ(CL x (VOH - VOL)
2
x fO)
N
where:
N = number of outputs = 36
CL = output capacitance load
fo = switching frequency of an output
VOH = output HIGH level voltage
VOL = output LOW level voltage
When no reads or writes are occurring on this device, the power dissipated by a single clock (CLKA or CLKB) input running at frequency fS is calculated
by:
PT = VCC x fS x 0.025 mA/MHz
Figure 1. Typical Characteristics: Supply Current (ICC) vs. Clock Frequency (fS)
010
20 30
40 50 60 70
0
25
50
75
100
125
150
V
CC
= 3.3V
f
S
Clock Frequency MHz
I
CC(f)
Supply Current mA
f
data
= 1/2 f
S
T
A
= 25°C
C
L
= 0 pF
V
CC
= 3.0V
4663 drw 04
V
CC
= 3.6V
80 90
175

72V3612L20PF

Mfr. #:
Manufacturer:
Description:
IC FIFO 64X36X2 20NS 120QFP
Lifecycle:
New from this manufacturer.
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