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LTC3411EDD#PBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
LTC3411
22
3411fb
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
3.00 p 0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38 p 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 p 0.10
(2 SIDES)
0.75 p 0.05
R = 0.115
TYP
2.38 p 0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1103
0.25 p 0.05
2.38 p 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 p 0.05
(2 SIDES)2.15 p 0.05
0.50
BSC
0.675 p 0.05
3.50 p 0.05
PACKAGE
OUTLINE
0.25 p 0.05
0.50 BSC
LTC3411
23
3411fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
MSOP (MS) 0307 REV E
0.53 p 0.152
(.021
p .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
12
3
45
4.90 p 0.152
(.193
p .006)
0.497 p 0.076
(.0196
p .003)
REF
8910
7
6
3.00 p 0.102
(.118
p .004)
(NOTE 3)
3.00 p 0.102
(.118
p .004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 p 0.127
(.035 p .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 p 0.038
(.0120 p .0015)
TYP
0.50
(.0197)
BSC
0.1016 p 0.0508
(.004
p .002)
LTC3411
24
3411fb
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2002
LT 1108 REV B • PRINTED IN USA
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ThinSOT is a trademark of Linear Technology Corporation.
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LTC3411EDD#PBF

Mfr. #:
Buy LTC3411EDD#PBF
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 1.25A, 4MHz, Sync Buck DC/DC Conv
Lifecycle:
New from this manufacturer.
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