Data Sheet fido5100/fido5200
Rev. 0 | Page 19 of 19
OUTLINE DIMENSIONS
0.80
BSC
PKG-000000
08-17-2017-A
BOTTOM VIEW
TOP VIEW
SIDE VIEW
DETAIL A
10.10
10.00 SQ
9.90
1.24 MAX
8.80 SQ
REF
A1 BALL
CORNER
A1 BALL
PAD CORNER
A
B
C
D
E
F
G
910 81112 7 56 4 23 1
H
J
K
L
M
0.91
0.86
0.81
0.45
0.40
0.35
COPLANARITY
0.12
BALL DIAMETER
DETAIL A
0.35
0.30
0.25
COMPLIANT WITH JEDEC STANDARDS MO-275-EEAB-1
SEATING
PLANE
Figure 12. 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-144-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
FIDO5100BBCZ −40°C to +85°C 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-144-12
FIDO5200BBCZ −40°C to +85°C 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-144-12
RAPID-NIEK-V0004 Evaluation Kit
1
Z = RoHS Compliant Part.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15833-0-10/17(0)

FIDO5100BBCZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Ethernet ICs REM Switch
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet